Issued Patents All Time
Showing 25 most recent of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12422615 | Nested glass packaging architecture for hybrid electrical and optical communication devices | Srinivas V. Pietambaram, Brandon C. Marin, Debendra Mallik, Tarek A. Ibrahim, Omkar G. Karhade +5 more | 2025-09-23 |
| 12412868 | Microelectronic assemblies including interconnects with different solder materials | Jason M. Gamba, Brandon C. Marin, Srinivas V. Pietambaram, Xiaoxuan Sun, Omkar G. Karhade +6 more | 2025-09-09 |
| 12394719 | Methods and apparatus to increase glass core thickness | Brandon C. Marin, Srinivas V. Pietambaram, Bai Nie | 2025-08-19 |
| 12353070 | Glass interposer optical switching device and method | Hiroki Tanaka, Brandon C. Marin, Kristof Darmawikarta, Srinivas V. Pietambaram, Hari Mahalingam +1 more | 2025-07-08 |
| 12354883 | Omni directional interconnect with magnetic fillers in mold matrix | Bohan Shan, Dingying Xu, Kristof Darmawikarta, Srinivas V. Pietambaram, Hongxia Feng +9 more | 2025-07-08 |
| 12306480 | Glass interposer optical resonator device and method | Hiroki Tanaka, Brandon C. Marin, Kristof Darmawikarta, Srinivas V. Pietambaram, Rajeev Ranjan | 2025-05-20 |
| 12255147 | Electronic substrate having an embedded etch stop to control cavity depth in glass layers therein | Brandon C. Marin, Srinivas V. Pietambaram, Suddhasattwa Nad | 2025-03-18 |
| 12255130 | Airgap structures for high speed signal integrity | Hongxia Feng, Aleksandar Aleksov, Haobo Chen, Xiaoying Guo, Brandon C. Marin +4 more | 2025-03-18 |
| 12224103 | Angled inductor with small form factor | Brandon C. Marin, Suddhasattwa Nad, Matthew Tingey, Ravindranath V. Mahajan, Srinivas V. Pietambaram | 2025-02-11 |
| 12191161 | Multi-step isotropic etch patterning of thick copper layers for forming high aspect-ratio conductors | Oladeji Fadayomi, Oscar Ojeda | 2025-01-07 |
| 12074102 | Structural elements for application specific electronic device packages | Suddhasattwa Nad, Ravindranath V. Mahajan, Brandon C. Marin, Mohammad Mamunur Rahman | 2024-08-27 |
| 12033930 | Selectively roughened copper architectures for low insertion loss conductive features | Jieying Kong, Yiyang Zhou, Suddhasattwa Nad, Hongxia Feng, Tarek A. Ibrahim +9 more | 2024-07-09 |
| 12027466 | Conductive route patterning for electronic substrates | Aleksandar Aleksov, Brandon C. Marin, Yonggang Li, Leonel Arana, Suddhasattwa Nad +2 more | 2024-07-02 |
| 11948848 | Subtractive etch resolution implementing a functional thin metal resist | Oscar Ojeda, Leonel Arana, Suddhasattwa Nad, Robert Alan May, Hiroki Tanaka +1 more | 2024-04-02 |
| 11942334 | Microelectronic assemblies having conductive structures with different thicknesses | Aleksandar Aleksov, Suddhasattwa Nad, Kristof Darmawikarta, Vahidreza Parichehreh, Veronica Strong +1 more | 2024-03-26 |
| 11855125 | Capacitors with nanoislands on conductive plates | Srinivas V. Pietambaram, Brandon C. Marin, Hiroki Tanaka, Frank Truong | 2023-12-26 |
| 11817349 | Conductive route patterning for electronic substrates | Brandon C. Marin, Leonel Arana, Matthew Tingey, Oscar Ojeda, Hsin-Wei Wang +3 more | 2023-11-14 |
| 11791228 | Method for forming embedded grounding planes on interconnect layers | Brandon C. Marin, Kristof Darmawikarta, Roy Dittler, Darko Grujicic | 2023-10-17 |
| 11721650 | Method for fabricating multiplexed hollow waveguides of variable type on a semiconductor package | Brandon C. Marin, Aleksandar Aleksov, Georgios Dogiamis, Suddhasattwa Nad, Mohammad Mamunur Rahman | 2023-08-08 |
| 11721631 | Via structures having tapered profiles for embedded interconnect bridge substrates | Hiroki Tanaka, Oscar Ojeda, Arnab Roy, Vahidreza Parichehreh, Leonel Arana +2 more | 2023-08-08 |
| 11694898 | Hybrid fine line spacing architecture for bump pitch scaling | Suddhasattwa Nad, Bai Nie, Rahul N. Manepalli, Marcel Wall | 2023-07-04 |
| 11670504 | Ultra-thin dielectric films using photo up-conversion for applications in substrate manufacturing and integrating passives | Brandon C. Marin, Andrew J. Brown, Dilan Seneviratne | 2023-06-06 |
| 11652071 | Electronic device package including a capacitor | Brandon C. Marin, Shivasubramanian Balasubramanian, Rahul Jain, Praneeth Akkinepally | 2023-05-16 |
| 11652036 | Via-trace structures | Hiroki Tanaka, Kristof Darmawikarta, Oscar Ojeda, Arnab Roy, Nicholas S. Haehn | 2023-05-16 |
| 11622448 | Sandwich-molded cores for high-inductance architectures | Brandon C. Marin, Tarek A. Ibrahim, Srinivas V. Pietambaram, Andrew J. Brown, Gang Duan +1 more | 2023-04-04 |