Issued Patents All Time
Showing 25 most recent of 152 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12183702 | Electronic package with varying interconnects | Kamal K. Sikka, Thomas E. Lombardi, Piyas Bal Chowdhury, Alfred Grill, Steven L. Wright | 2024-12-31 |
| 11756930 | High bandwidth module | Bhupender Singh, Shidong Li, Chris Muzzy, Thomas A. Wassick | 2023-09-12 |
| 11694992 | Near tier decoupling capacitors | Bhupender Singh, Joseph C. Sorbello, Joseph Jacobi, Thomas E. Lombardi, Shidong Li +1 more | 2023-07-04 |
| 11521952 | Spacer for die-to-die communication in an integrated circuit and method for fabricating the same | Bhupender Singh, Richard F. Indyk, Steve Ostrander, Thomas Weiss, Mark W. Kapfhammer | 2022-12-06 |
| 11410894 | Polygon integrated circuit (IC) packaging | Richard F. Indyk, Bhupender Singh, Jon A. Casey, Shidong Li | 2022-08-09 |
| 11404365 | Direct attachment of capacitors to flip chip dies | Bhupender Singh, Mark W. Kapfhammer, Brian W. Quinlan, Sylvain Pharand | 2022-08-02 |
| 11393759 | Alignment carrier for interconnect bridge assembly | Thomas Weiss, Glenn A. Pomerantz, Rachel E. Olson, Mark W. Kapfhammer, Bhupender Singh | 2022-07-19 |
| 11388821 | Thin film capacitors for core and adjacent build up layers | Brian W. Quinlan, Charles L. Reynolds, Jean Audet, Francesco Preda | 2022-07-12 |
| 11282773 | Enlarged conductive pad structures for enhanced chip bond assembly yield | Krishna R. Tunga, Thomas Weiss, Bhupender Singh, Brian W. Quinlan | 2022-03-22 |
| 11270964 | Mixed UBM and mixed pitch on a single die | Christopher D. Muzzy | 2022-03-08 |
| 11235404 | Personalized copper block for selective solder removal | Luca Del Carro, Thomas J. Brunschwiler, Thomas Weiss, Chris Muzzy | 2022-02-01 |
| 11239183 | Mitigating thermal-mechanical strain and warpage of an organic laminate substrate | Tuhin Sinha, Krishna R. Tunga, Brian W. Quinlan, Steven P. Ostrander, Thomas Weiss | 2022-02-01 |
| 11201136 | High bandwidth module | Bhupender Singh, Shidong Li, Chris Muzzy, Thomas A. Wassick | 2021-12-14 |
| 11180398 | Deionized-water cooling for electrical equipment | Prabjit Singh, Lawrence Palmer, Levi A. Campbell | 2021-11-23 |
| 11177217 | Direct bonded heterogeneous integration packaging structures | Kamal K. Sikka, Jon A. Casey, Joshua M. Rubin, Arvind Kumar, Dinesh Gupta +5 more | 2021-11-16 |
| 11168400 | Formation of terminal metallurgy on laminates and boards | Brian M. Erwin, Chris Muzzy, Thomas Weiss | 2021-11-09 |
| 11164804 | Integrated circuit (IC) device package lid attach utilizing nano particle metallic paste | Kevin Drummond, Luca Del Carro, Thomas J. Brunschwiler, Stephanie Allard, Kenneth C. Marston +1 more | 2021-11-02 |
| 11152282 | Localized catalyst for enhanced thermal interface material heat transfer | Kevin Drummond, Kenneth C. Marston, Chris Muzzy, Sushumna Iruvanti | 2021-10-19 |
| 11121101 | Flip chip packaging rework | Karen P. McLaughlin, Thomas A. Wassick, Brian W. Quinlan | 2021-09-14 |
| 11053604 | System for treating solution for use in electroplating application and method for treating solution for use in electroplating application | Glen N. Biggs, Phillip W. Palmatier, Joseph C. Sorbello, Tracy A. Tong, Freddie Torres | 2021-07-06 |
| 11043468 | Lead-free solder joining of electronic structures | Clement Fortin, Christopher D. Muzzy, Thomas A. Wassick | 2021-06-22 |
| 11031373 | Spacer for die-to-die communication in an integrated circuit | Bhupender Singh, Richard F. Indyk, Steve Ostrander, Thomas Weiss, Mark W. Kapfhammer | 2021-06-08 |
| 11031343 | Fins for enhanced die communication | Richard F. Indyk, Bhupender Singh, Jon A. Casey | 2021-06-08 |
| 11009545 | Integrated circuit tester probe contact liner | David M. Audette, Dennis R. Conti, Brian M. Erwin, Grant Wagner | 2021-05-18 |
| 11004614 | Stacked capacitors for use in integrated circuit modules and the like | Sylvain Pharand, Bhupender Singh, Brian W. Quinlan | 2021-05-11 |