Issued Patents All Time
Showing 101–125 of 137 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6946716 | Electroplated interconnection structures on integrated circuit chips | Panayotis Andricacos, Harikilia Deligianni, John O. Dukovic, Daniel C. Edelstein, Wilma Jean Horkans +4 more | 2005-09-20 |
| 6909772 | Method and apparatus for thin film thickness mapping | Krzysztof Kozaczek, David S. Kurtz, Paul R. Moran, Roger Isaac Martin, Patrick W. DeHaven +1 more | 2005-06-21 |
| 6870263 | Device interconnection | Lawrence A. Clevenger, Ronald G. Filippi, Mark Hoinkis, Jeffery L. Hurd, Roy Iggulden +5 more | 2005-03-22 |
| 6836106 | Apparatus and method for testing semiconductors | Kevin Brelsford, Ronald G. Filippi, Ping-Chuan Wang | 2004-12-28 |
| 6831364 | Method for forming a porous dielectric material layer in a semiconductor device and device formed | Timothy J. Dalton, Stephen E. Greco, Jeffrey Hedrick, Satyanarayana V. Nitta, Sampath Purushothaman +1 more | 2004-12-14 |
| 6792075 | Method and apparatus for thin film thickness mapping | Krzysztof Kozaczek, David S. Kurtz, Paul R. Moran, Roger Isaac Martin, Patrick W. DeHaven +1 more | 2004-09-14 |
| 6712681 | Polishing pads with polymer filled fibrous web, and methods for fabricating and using same | Shyng-Tsong Chen, Oscar K. Hsu, Jean Vangsness, David S. Gilbride, Scott C. Billings +1 more | 2004-03-30 |
| 6709562 | Method of making electroplated interconnection structures on integrated circuit chips | Panayotis Andricacos, Hariklia Deligianni, John O. Dukovic, Daniel C. Edelstein, Wilma Jean Horkans +4 more | 2004-03-23 |
| 6685548 | Grooved polishing pads and methods of use | Shyng-Tsong Chen, Kenneth M. Davis | 2004-02-03 |
| 6656019 | Grooved polishing pads and methods of use | Shyng-Tsong Chen, Kenneth M. Davis | 2003-12-02 |
| 6632377 | Chemical-mechanical planarization of metallurgy | Vlasta Brusic, Daniel C. Edelstein, Paul M. Feeney, William L. Guthrie, Mark A. Jaso +4 more | 2003-10-14 |
| 6589874 | Method for forming electromigration-resistant structures by doping | Panayotis Andricacos, Cyril Cabral, Jr., Christopher C. Parks, Roger Y. Tsai | 2003-07-08 |
| 6570255 | Method for forming interconnects on semiconductor substrates and structures formed | Panayotis Andricacos, Cyril Cabral, Jr., John M. Cotte, Lynne M. Gignac, Wilma Jean Horkans | 2003-05-27 |
| 6451712 | Method for forming a porous dielectric material layer in a semiconductor device and device formed | Timothy J. Dalton, Stephen E. Greco, Jeffrey Hedrick, Satyanarayana V. Nitta, Sampath Purushothaman +1 more | 2002-09-17 |
| 6452276 | Ultra thin, single phase, diffusion barrier for metal conductors | Stephan A. Cohen, Fenton R. McFeely, Cevdet I. Noyan, John J. Yurkas, Robert Rosenberg | 2002-09-17 |
| 6448173 | Aluminum-based metallization exhibiting reduced electromigration and method therefor | Lawrence A. Clevenger, Ronald G. Filippi, Roy Iggulden, Chao-Kun Hu, Lynne M. Gignac +3 more | 2002-09-10 |
| 6429523 | Method for forming interconnects on semiconductor substrates and structures formed | Panayotis Andricacos, Cyril Cabral, Jr., John M. Cotte, Lynne M. Gignac, Wilma Jean Horkans | 2002-08-06 |
| 6413866 | Method of forming a solute-enriched layer in a substrate surface and article formed thereby | Horatio S. Wildman, Lawrence A. Clevenger, Chenting Lin, Stefan Weber, Roy Iggulden +2 more | 2002-07-02 |
| 6396151 | Partially-overlapped interconnect structure and method of making | Evan G. Colgan, Jeffery P. GAMBINO | 2002-05-28 |
| 6383066 | Multilayered polishing pad, method for fabricating, and use thereof | Shyng-Tsong Chen, Alex Siu Keung Chung, Oscar K. Hsu, Jean Vangsness | 2002-05-07 |
| 6346175 | Modification of in-plate refractory metal texture by use of refractory metal/nitride layer | Evan G. Colgan, James M. E. Harper, Hiroshi Takatsuji | 2002-02-12 |
| 6344129 | Method for plating copper conductors and devices formed | Panayotis Andricacos, Cyril Cabral, Jr., Lynne M. Gignac, Cyprian Emeka Uzoh, Peter S. Locke | 2002-02-05 |
| 6340325 | Polishing pad grooving method and apparatus | Shyng-Tsong Chen, Alex Siu Keung Chung, Kenneth M. Davis, Oscar K. Hsu | 2002-01-22 |
| 6333120 | Method for controlling the texture and microstructure of plated copper and plated structure | Patrick W. DeHaven, Peter S. Locke, Cyprian Emeka Uzoh | 2001-12-25 |
| 6268291 | Method for forming electromigration-resistant structures by doping | Panayotis Andricacos, Cyril Cabral, Jr., Christopher C. Parks, Roger Y. Tsai | 2001-07-31 |