Issued Patents All Time
Showing 151–175 of 584 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9099427 | Thermal energy dissipation using backside thermoelectric devices | Nathaniel R. Chadwick, Kirk D. Peterson | 2015-08-04 |
| 9093503 | Semiconductor chip with a dual damascene wire and through-substrate via (TSV) structure | Fen Chen, Mukta G. Farooq, Zhong-Xiang He, Kevin S. Petrarca, Anthony K. Stamper | 2015-07-28 |
| 9087754 | Structures and methods for improving solder bump connections in semiconductor devices | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2015-07-21 |
| 9059360 | Photoconductor-on-active pixel device | Robert K. Leidy, Richard J. Rassel | 2015-06-16 |
| 9059180 | Thick bond pad for chip with cavity package | Robert K. Leidy, Richard J. Rassel | 2015-06-16 |
| 9059111 | Reliable back-side-metal structure | Robert D. Edwards, Charles F. Musante, Ping-Chuan Wang | 2015-06-16 |
| 9059106 | Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2015-06-16 |
| 9058455 | Backside integration of RF filters for RF front end modules and design structure | James W. Adkisson, Panglijen Candra, Thomas J. Dunbar, Mark D. Jaffe, Anthony K. Stamper +1 more | 2015-06-16 |
| 9048809 | Method of manufacturing switchable filters | James W. Adkisson, Panglijen Candra, Thomas J. Dunbar, Mark D. Jaffe, Anthony K. Stamper +1 more | 2015-06-02 |
| 9041210 | Through silicon via wafer and methods of manufacturing | Jessica A. Levy, Cameron E. Luce, Daniel S. Vanslette, Bucknell C. Webb | 2015-05-26 |
| 9029949 | Semiconductor-on-insulator (SOI) structures with local heat dissipater(s) and methods | Qizhi Liu, Zhenzhen Ye, Yan Zhang | 2015-05-12 |
| 9018760 | Solder interconnect with non-wettable sidewall pillars and methods of manufacture | Charles L. Arvin, Raschid J. Bezama, Timothy H. Daubenspeck, Christopher D. Muzzy, David L. Questad +3 more | 2015-04-28 |
| 9018754 | Heat dissipative electrical isolation/insulation structure for semiconductor devices and method of making | Qizhi Liu, Zhenzhen Ye, Yan Zhang | 2015-04-28 |
| 9006703 | Method for reducing lateral extrusion formed in semiconductor structures and semiconductor structures formed thereof | Shawn A. Adderly, Brian M. Czabaj, Daniel A. Delibac, Matthew D. Moon, David C. Thomas | 2015-04-14 |
| 9002156 | Vertically curved waveguide | John J. Ellis-Monaghan, Mark D. Jaffe, Kirk D. Peterson, Jed H. Rankin | 2015-04-07 |
| 9000585 | Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter, Jeffrey S. Zimmerman | 2015-04-07 |
| 8994173 | Solder bump connection and method of making | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2015-03-31 |
| 8993428 | Structure and method to create a damascene local interconnect during metal gate deposition | John J. Ellis-Monaghan, Kirk D. Peterson, Jed H. Rankin, Robert R. Robison | 2015-03-31 |
| 8987067 | Segmented guard ring structures with electrically insulated gap structures and design structures thereof | Robert L. Barry, Phillip F. Chapman, Michael L. Gautsch, Mark D. Jaffe, Kevin N. Ogg +1 more | 2015-03-24 |
| 8986523 | Biosensor capacitor | Kristin M. Ackerson, John J. Ellis-Monaghan, Yen L. Lim, Polina A. Razina | 2015-03-24 |
| 8957405 | Graphene field effect transistor | James W. Adkisson, Thomas J. Dunbar, Molly J. Leitch | 2015-02-17 |
| 8946013 | Lateral diffusion field effect transistor with drain region self-aligned to gate electrode | Natalie B. Feilchenfeld, Xuefeng Liu, Benjamin T. Voegeli, Steven H. Voldman, Michael J. Zierak | 2015-02-03 |
| 8937009 | Far back end of the line metallization method and structures | Timothy H. Daubenspeck, Karen P. McLaughlin, Ekta Misra, Christopher D. Muzzy, Eric D. Perfecto +1 more | 2015-01-20 |
| 8933540 | Thermal via for 3D integrated circuits structures | Timothy H. Daubenspeck, Michael J. Hauser, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2015-01-13 |
| 8932920 | Self-aligned gate electrode diffusion barriers | John J. Ellis-Monaghan, Russell T. Herrin, Laura J. Schutz, Steven M. Shank | 2015-01-13 |