Issued Patents All Time
Showing 126–150 of 584 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9287345 | Semiconductor structure with thin film resistor and terminal bond pad | Fen Chen, Zhong-Xiang He, Tom C. Lee, John C. Malinowski, Anthony K. Stamper | 2016-03-15 |
| 9275868 | Uniform roughness on backside of a wafer | Shawn A. Adderly, Max L. Lifson, Matthew D. Moon, William J. Murphy, Timothy D. Sullivan +1 more | 2016-03-01 |
| 9275744 | Method of restoring a flash memory in an integrated circuit chip package by addition of heat and an electric field | Eduard A. Cartier, Adam J. McPadden, Gary A. Tressler | 2016-03-01 |
| 9269683 | Integrated circuit chip with pyramid or cone-shaped conductive pads for flexible C4 connections and a method of forming the integrated circuit chip | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2016-02-23 |
| 9269642 | Methods for testing integrated circuits of wafer and testing structures for integrated circuits | Michael T. Coster, Mark A. DiRocco, Kirk D. Peterson | 2016-02-23 |
| 9257352 | Semiconductor test wafer and methods for use thereof | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2016-02-09 |
| 9257324 | Forming structures on resistive substrates | Alan B. Botula, Renata Camillo-Castillo, James S. Dunn, Douglas B. Hershberger, Alvin J. Joseph +2 more | 2016-02-09 |
| 9252733 | Switchable filters and design structures | James W. Adkisson, Panglijen Candra, Thomas J. Dunbar, Mark D. Jaffe, Anthony K. Stamper +1 more | 2016-02-02 |
| 9252080 | Dielectric cover for a through silicon via | Daniel J. Couture, Zhong-Xiang He, Anthony K. Stamper | 2016-02-02 |
| 9245850 | Through silicon via wafer, contacts and design structures | Cameron E. Luce, Daniel S. Vanslette, Bucknell C. Webb | 2016-01-26 |
| 9231046 | Capacitor using barrier layer metallurgy | Timothy H. Daubenspeck, Zhong-Xiang He, Christopher D. Muzzy, Wolfgang Sauter | 2016-01-05 |
| 9230929 | Semiconductor structures and methods of manufacture | Timothy H. Daubenspeck, Zhong-Xiang He, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2016-01-05 |
| 9230914 | Copper wire and dielectric with air gaps | Fen Chen, Zhong-Xiang He, Trevor A. Thompson, Eric J. White | 2016-01-05 |
| 9196519 | Achieving uniform capacitance between an electrostatic chuck and a semiconductor wafer | Shawn A. Adderly, William J. Murphy, Jonathan D. Chapple-Sokol | 2015-11-24 |
| 9196528 | Use of contacts to create differential stresses on devices | John J. Ellis-Monaghan, Kirk D. Peterson, Jed H. Rankin, Robert R. Robison | 2015-11-24 |
| 9196592 | Methods of managing metal density in dicing channel and related integrated circuit structures | Edward C. Cooney, III, Richard S. Graf, Gary L. Milo | 2015-11-24 |
| 9190318 | Method of forming an integrated crackstop | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2015-11-17 |
| 9184112 | Cooling apparatus for an integrated circuit | Richard S. Graf, Sudeep Mandal, Sebastian T. Ventrone | 2015-11-10 |
| 9171971 | Encapsulated sensors | John J. Ellis-Monaghan, Mark D. Jaffe, William J. Murphy, Kirk D. Peterson, Steven M. Shank | 2015-10-27 |
| 9165831 | Dice before grind with backside metal | Timothy H. Daubenspeck, Charles F. Musante, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2015-10-20 |
| 9165850 | Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2015-10-20 |
| 9159671 | Copper wire and dielectric with air gaps | Fen Chen, Zhong-Xiang He, Trevor A. Thompson, Eric J. White | 2015-10-13 |
| 9159696 | Plug via formation by patterned plating and polishing | Timothy H. Daubenspeck, Ekta Misra, Christopher D. Muzzy, Wolfgang Sauter | 2015-10-13 |
| 9105465 | Wafer edge conditioning for thinned wafers | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2015-08-11 |
| 9099982 | Method of manufacturing switching filters and design structures | James W. Adkisson, Panglijen Candra, Thomas J. Dunbar, Mark D. Jaffe, Anthony K. Stamper +1 more | 2015-08-04 |