Issued Patents All Time
Showing 176–200 of 584 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8927334 | Overcoming chip warping to enhance wetting of solder bumps and flip chip attaches in a flip chip package | Timothy H. Daubenspeck, Christopher D. Muzzy, Nathalie Normand, David L. Questad, Wolfgang Sauter +1 more | 2015-01-06 |
| 8927411 | System and method for forming an aluminum fuse for compatibility with copper BEOL interconnect scheme | Felix P. Anderson, Timothy H. Daubenspeck, Timothy S. Hayes, Donald R. Letourneau, Thomas L. McDevitt +1 more | 2015-01-06 |
| 8927869 | Semiconductor structures and methods of manufacture | Timothy H. Daubenspeck, Zhong-Xiang He, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2015-01-06 |
| 8921975 | System and method for forming aluminum fuse for compatibility with copper BEOL interconnect scheme | Felix P. Anderson, Timothy H. Daubenspeck, Timothy S. Hayes, Donald R. Letourneau, Thomas L. McDevitt +1 more | 2014-12-30 |
| 8916464 | Structures and methods for improving solder bump connections in semiconductor devices | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2014-12-23 |
| 8916463 | Wire bond splash containment | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2014-12-23 |
| 8912091 | Backside metal ground plane with improved metal adhesion and design structures | Jay Burnham, Damyon L. Corbin, George A. Dunbar, III, John C. Hall, Kenneth F. McAvey, Jr. +2 more | 2014-12-16 |
| 8910355 | Method of manufacturing a film bulk acoustic resonator with a loading element | James W. Adkisson, Panglijen Candra, Thomas J. Dunbar, Mark D. Jaffe, Anthony K. Stamper +1 more | 2014-12-16 |
| 8901738 | Method of manufacturing an enhanced electromigration performance hetero-junction bipolar transistor | David L. Harame, Baozhen Li, Timothy D. Sullivan, Bjorn K. A. Zetterlund | 2014-12-02 |
| 8903210 | Vertical bend waveguide coupler for photonics applications | John J. Ellis-Monaghan, Mark D. Jaffe, Kirk D. Peterson, Jed H. Rankin | 2014-12-02 |
| 8900964 | Inductors and wiring structures fabricated with limited wiring material | Hanyi Ding, Zhong-Xiang He, Alvin J. Joseph, Anthony K. Stamper, Timothy D. Sullivan | 2014-12-02 |
| 8878326 | Imager microlens structure having interfacial region for adhesion of protective layer | Edward C. Cooney, III, Robert K. Leidy, Charles F. Musante, John G. Twombly | 2014-11-04 |
| 8871549 | Biological and chemical sensors | John J. Ellis-Monaghan, Derrick Liu | 2014-10-28 |
| 8847401 | Semiconductor structure incorporating a contact sidewall spacer with a self-aligned airgap and a method of forming the semiconductor structure | Fen Chen, Zhong-Xiang He, Xin Wang, Yanfeng Wang | 2014-09-30 |
| 8835029 | Fuse for three dimensional solid-state battery | John J. Ellis-Monaghan, Kirk D. Peterson, Jed H. Rankin | 2014-09-16 |
| 8828870 | Microstructure modification in copper interconnect structures | Cyril Cabral, Jr., Qiang Huang, Takeshi Nogami, Kenneth P. Rodbell | 2014-09-09 |
| 8829626 | MEMS switches and fabrication methods | Stephen A. Mongeon | 2014-09-09 |
| 8819933 | Method for forming a current distribution structure | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2014-09-02 |
| 8822993 | Integrated circuit including sensor structure, related method and design structure | Edward C. Cooney, III, Zhong-Xiang He, Tom C. Lee | 2014-09-02 |
| 8815671 | Use of contacts to create differential stresses on devices | John J. Ellis-Monaghan, Kirk D. Peterson, Jed H. Rankin, Robert R. Robison | 2014-08-26 |
| 8815733 | Isolated wire structures with reduced stress, methods of manufacturing and design structures | Zhong-Xiang He, Tom C. Lee | 2014-08-26 |
| 8809182 | Pad cushion structure and method of fabrication for Pb-free C4 integrated circuit chip joining | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2014-08-19 |
| 8803284 | Thick on-chip high-performance wiring structures | Edward C. Cooney, III, Zhong-Xiang He, Tom C. Lee, Xiao Hu Liu | 2014-08-12 |
| 8796130 | Diffusion barrier for oppositely doped portions of gate conductor | Russell T. Herrin, Mark D. Jaffe, Laura J. Schutz | 2014-08-05 |
| 8791712 | 3-dimensional integrated circuit testing using MEMS switches with tungsten cone contacts | John J. Ellis-Monaghan, Kirk D. Peterson, Jed H. Rankin | 2014-07-29 |