Issued Patents All Time
Showing 226–250 of 584 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8637392 | Solder interconnect with non-wettable sidewall pillars and methods of manufacture | Charles L. Arvin, Raschid J. Bezama, Timothy H. Daubenspeck, Christopher D. Muzzy, David L. Questad +3 more | 2014-01-28 |
| 8633055 | Graphene field effect transistor | James W. Adkisson, Thomas J. Dunbar, Molly J. Leitch | 2014-01-21 |
| 8629557 | Structures and methods for detecting solder wetting of pedestal sidewalls | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2014-01-14 |
| 8618588 | Anti-blooming pixel sensor cell with active neutral density filter, methods of manufacture, and design structure | Kristin M. Ackerson, Mark D. Jaffe, Robert K. Leidy, Richard J. Rassel, Robert M. Rassel | 2013-12-31 |
| 8609450 | MEMS switches and fabrication methods | Stephen A. Mongeon | 2013-12-17 |
| 8604618 | Structure and method for reducing vertical crack propagation | Edward C. Cooney, III, Zhong-Xiang He, Xiao Hu Liu, Thomas L. McDevitt, Gary L. Milo +1 more | 2013-12-10 |
| 8592941 | Fuse structure having crack stop void, method for forming and programming same, and design structure | Tom C. Lee, Kevin G. Petrunich, David C. Thomas | 2013-11-26 |
| 8592268 | Semiconductor structures using replacement gate and methods of manufacture | John J. Ellis-Monaghan, Kirk D. Peterson, Jed H. Rankin | 2013-11-26 |
| 8592244 | Pixel sensor cells and methods of manufacturing | Robert K. Leidy, Mark D. Levy | 2013-11-26 |
| 8580673 | Underfill flow guide structures and method of using same | Timothy H. Daubenspeck, Christopher D. Muzzy, Marie-Claude Paquet, Wolfgang Sauter, Timothy D. Sullivan | 2013-11-12 |
| 8575007 | Selective electromigration improvement for high current C4s | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter, Thomas A. Wassick | 2013-11-05 |
| 8575022 | Top corner rounding of damascene wire for insulator crack suppression | Gregory S. Chrisman, Edward C. Cooney, III, Zhong-Xiang He, Thomas L. McDevitt, Eva A. Shah | 2013-11-05 |
| 8569888 | Wiring structure and method of forming the structure | Fen Chen, Anthony K. Stamper, Timothy D. Sullivan | 2013-10-29 |
| 8563398 | Electrically conductive path forming below barrier oxide layer and integrated circuit | Gregory Costrini, Ramachandra Divakaruni, Randy W. Mann | 2013-10-22 |
| 8563336 | Method for forming thin film resistor and terminal bond pad simultaneously | Fen Chen, Zhong-Xiang He, Tom C. Lee, John C. Malinowski, Anthony K. Stamper | 2013-10-22 |
| 8551859 | Biosensors integrated with a microfluidic structure | Kristin M. Ackerson, John J. Ellis-Monaghan, Yen L. Lim | 2013-10-08 |
| 8546253 | Self-aligned polymer passivation/aluminum pad | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2013-10-01 |
| 8513814 | Buffer pad in solder bump connections and methods of manufacture | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2013-08-20 |
| 8508043 | Metal pad structure for thickness enhancement of polymer used in electrical interconnection of semiconductor die to semiconductor chip package substrate with solder bump | Timothy H. Daubenspeck, Christopher D. Muzzy, David L. Questad, Wolfgang Sauter, Timothy D. Sullivan | 2013-08-13 |
| 8492897 | Microstructure modification in copper interconnect structures | Cyril Cabral, Jr., Qiang Huang, Takeshi Nogami, Kenneth P. Rodbell | 2013-07-23 |
| 8492892 | Solder bump connections | Timothy H. Daubenspeck, Ekta Misra, Christopher D. Muzzy, Wolfgang Sauter, George J. Scott | 2013-07-23 |
| 8492807 | Micro-electro-mechanical system tiltable lens | John J. Ellis-Monaghan, Kirk D. Peterson, Jed H. Rankin | 2013-07-23 |
| 8492272 | Passivated through wafer vias in low-doped semiconductor substrates | James W. Adkisson, Mark D. Jaffe, Alvin J. Joseph | 2013-07-23 |
| 8492267 | Pillar interconnect chip to package and global wiring structure | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2013-07-23 |
| 8487401 | Methods of fabricating passive element without planarizing and related semiconductor device | Anil K. Chinthakindi, Timothy J. Dalton, Ebenezer E. Eshun, Anthony K. Stamper, Kunal Vaed | 2013-07-16 |