Issued Patents All Time
Showing 251–275 of 584 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8476762 | Ni plating of a BLM edge for Pb-free C4 undercut control | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2013-07-02 |
| 8476099 | Methods for improved adhesion of protective layers of imager microlens structures by forming an interfacial region | Edward C. Cooney, III, Robert K. Leidy, Charles F. Musante, John G. Twombly | 2013-07-02 |
| 8471306 | Double-sided integrated circuit chips | Kerry Bernstein, Timothy J. Dalton, Mark D. Jaffe, Paul D. Kartschoke, Stephen E. Luce +1 more | 2013-06-25 |
| 8470713 | Nitride etch for improved spacer uniformity | James A. Culp, John J. Ellis-Monaghan, Kirk D. Peterson, Jed H. Rankin, Christa R. Willets | 2013-06-25 |
| 8460981 | Use of contacts to create differential stresses on devices | John J. Ellis-Monaghan, Kirk D. Peterson, Jed H. Rankin, Robert R. Robison | 2013-06-11 |
| 8450822 | Thick bond pad for chip with cavity package | Robert K. Leidy, Richard J. Rassel | 2013-05-28 |
| 8450168 | Ferro-electric capacitor modules, methods of manufacture and design structures | Matthew D. Moon, William J. Murphy, James S. Nakos, Paul William Pastel, Brett A. Philips | 2013-05-28 |
| 8440519 | Semiconductor structures using replacement gate and methods of manufacture | John J. Ellis-Monaghan, Kirk D. Peterson, Jed H. Rankin | 2013-05-14 |
| 8426247 | Polymer and solder pillars for connecting chip and carrier | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2013-04-23 |
| 8421126 | Double-sided integrated circuit chips | Kerry Bernstein, Timothy J. Dalton, Mark D. Jaffe, Paul D. Kartschoke, Stephen E. Luce +1 more | 2013-04-16 |
| 8409980 | Underfill flow guide structures and method of using same | Timothy H. Daubenspeck, Christopher D. Muzzy, Marie-Claude Paquet, Wolfgang Sauter, Timothy D. Sullivan | 2013-04-02 |
| 8409904 | Methods for forming anti-reflection structures for CMOS image sensors | James W. Adkisson, John J. Ellis-Monaghan, Charles F. Musante | 2013-04-02 |
| 8409899 | Delamination and crack resistant image sensor structures and methods | Mark D. Jaffe, Robert K. Leidy, Charles F. Musante, Richard J. Rassel | 2013-04-02 |
| 8394718 | Methods of forming self-aligned through silicon via | Robert K. Leidy, Anthony K. Stamper | 2013-03-12 |
| 8373275 | Fine pitch solder bump structure with built-in stress buffer | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2013-02-12 |
| 8361598 | Substrate anchor structure and method | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter | 2013-01-29 |
| 8350383 | IC chip package having IC chip with overhang and/or BGA blocking underfill material flow and related methods | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2013-01-08 |
| 8349728 | Method of fabricating copper damascene and dual damascene interconnect wiring | William R. Hill, Kenneth E. McAvey, Jr., Thomas L. McDevitt, Anthony K. Stamper, Arthur C. Winslow +1 more | 2013-01-08 |
| 8343868 | Device and methodology for reducing effective dielectric constant in semiconductor devices | Daniel C. Edelstein, Matthew E. Colburn, Edward C. Cooney, III, Timothy J. Dalton, John A. Fitzsimmons +10 more | 2013-01-01 |
| 8334195 | Pixel sensors of multiple pixel size and methods of implant dose control | John J. Ellis-Monaghan, Daniel N. Maynard, Richard J. Rassel | 2012-12-18 |
| 8298860 | Methods for forming a bonded semiconductor substrate including a cooling mechanism | Anthony K. Stamper | 2012-10-30 |
| 8298937 | Interconnect structure fabricated without dry plasma etch processing | Maxime Darnon, Elbert E. Huang, Qinghuang Lin | 2012-10-30 |
| 8299475 | Interlevel conductive light shield | Zhong-Xiang He, Kevin N. Ogg, Richard J. Rassel, Robert M. Rassel | 2012-10-30 |
| 8299554 | Image sensor, method and design structure including non-planar reflector | James W. Adkisson, Robert K. Leidy, John J. Ellis-Monaghan | 2012-10-30 |
| 8299563 | Methods for forming a bonded semiconductor substrate including a cooling mechanism | Anthony K. Stamper | 2012-10-30 |