Issued Patents All Time
Showing 76–100 of 584 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9852944 | Backside contact to a final substrate | Mark D. Jaffe, Steven M. Shank, Anthony K. Stamper | 2017-12-26 |
| 9843303 | Switchable filters and design structures | James W. Adkisson, Panglijen Candra, Thomas J. Dunbar, Mark D. Jaffe, Anthony K. Stamper +1 more | 2017-12-12 |
| 9831122 | Integrated circuit including wire structure, related method and design structure | Edward C. Cooney, III, Zhong-Xiang He, Robert K. Leidy | 2017-11-28 |
| 9799720 | Inductor heat dissipation in an integrated circuit | Qizhi Liu, Zhenzhen Ye, Yan Zhang | 2017-10-24 |
| 9798088 | Barrier structures for underfill blockout regions | Robert K. Leidy, Wolfgang Sauter, Christopher D. Muzzy, Eric Turcotte, Thomas E. Lombardi | 2017-10-24 |
| 9786835 | Backside integration of RF filters for RF front end modules and design structure | James W. Adkisson, Panglijen Candra, Thomas J. Dunbar, Mark D. Jaffe, Anthony K. Stamper +1 more | 2017-10-10 |
| 9759868 | Structures for preventing dicing damage | Brett T. Cucci, Paul F. Fortier, Robert K. Leidy, Qizhi Liu, Richard J. Rassel | 2017-09-12 |
| 9740080 | Waveguide switch with tuned photonic microring | John J. Ellis-Monaghan, Mark D. Jaffe, Kirk D. Peterson, Jed H. Rankin | 2017-08-22 |
| 9716010 | Handle wafer | Kenneth F. McAvey, Jr., Charles F. Musante, Bruce W. Porth, Anthony K. Stamper, Timothy D. Sullivan | 2017-07-25 |
| 9715064 | Multi-chip modules with vertically aligned grating couplers for transmission of light signals between optical waveguides | Robert K. Leidy, John J. Ellis-Monaghan, Brett T. Cucci, Jeffrey C. Maling, Jessie C. Rosenberg | 2017-07-25 |
| 9691623 | Semiconductor structures having low resistance paths throughout a wafer | Thomas J. Hartswick, Zhong-Xiang He, Anthony K. Stamper, Eric J. White | 2017-06-27 |
| 9685370 | Titanium tungsten liner used with copper interconnects | Jonathan D. Chapple-Sokol, Cathryn J. Christiansen, Tom C. Lee, William J. Murphy, Anthony K. Stamper | 2017-06-20 |
| 9685362 | Apparatus and method for centering substrates on a chuck | Shawn A. Adderly, Samantha D. DiStefano, Max G. Levy, Max L. Lifson, Matthew D. Moon +1 more | 2017-06-20 |
| 9679806 | Nanowires for pillar interconnects | Charles L. Arvin, Christopher D. Muzzy, Wolfgang Sauter | 2017-06-13 |
| 9659835 | Techniques for integrating thermal via structures in integrated circuits | Richard S. Graf, Sundeep Mandal | 2017-05-23 |
| 9633962 | Plug via formation with grid features in the passivation layer | Timothy H. Daubenspeck, Ekta Misra, Christopher D. Muzzy, Wolfgang Sauter | 2017-04-25 |
| 9627575 | Photodiode structures | John J. Ellis-Monaghan, Mark D. Jaffe, Kirk D. Peterson | 2017-04-18 |
| 9620371 | Semiconductor structures having low resistance paths throughout a wafer | Thomas J. Hartswick, Zhong-Xiang He, Anthony K. Stamper, Eric J. White | 2017-04-11 |
| 9613921 | Structure to prevent solder extrusion | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2017-04-04 |
| 9613853 | Copper wire and dielectric with air gaps | Fen Chen, Zhong-Xiang He, Trevor A. Thompson, Eric J. White | 2017-04-04 |
| 9608403 | Dual bond pad structure for photonics | Richard S. Graf, Robert K. Leidy, Jeffrey C. Maling | 2017-03-28 |
| 9607929 | Tsv wafer with improved fracture strength | James W. Adkisson, Yoba Amoah, Christine A. Leggett, Max L. Lifson, Charles F. Musante +2 more | 2017-03-28 |
| 9607862 | Extrusion-resistant solder interconnect structures and methods of forming | Timothy H. Daubenspeck, Christopher D. Muzzy, Wolfgang Sauter, Timothy D. Sullivan | 2017-03-28 |
| 9585257 | Method of forming a glass interposer with thermal vias | Richard S. Graf, Sudeep Mandal, David J. Russell | 2017-02-28 |
| 9583451 | Conductive pillar shaped for solder confinement | Charles L. Arvin, Christopher D. Muzzy, Wolfgang Sauter | 2017-02-28 |