Issued Patents 2022
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521923 | Integrated circuit package supports | Kevin Thomas McCarthy | 2022-12-06 |
| 11515232 | Liquid cooling through conductive interconnect | Chia-Pin Chiu, Pooya Tadayon | 2022-11-29 |
| 11444033 | Hybrid microelectronic substrate and methods for fabricating the same | Robert Starkston, Scott M. Mokler, Richard C. Stamey | 2022-09-13 |
| 11430740 | Microelectronic device with embedded die substrate on interposer | Robert Alan May, Islam A. Salama, Sri Ranga Sai Boyapati, Sheng Li, Kristof Darmawikarta +1 more | 2022-08-30 |
| 11430724 | Ultra-thin, hyper-density semiconductor packages | Debendra Mallik, Robert M. Nickerson, Mitul Modi, Sanka Ganesan, Rajasekaran Swaminathan +4 more | 2022-08-30 |
| 11410919 | Stacked silicon die architecture with mixed flipcip and wirebond interconnect | Sanka Ganesan | 2022-08-09 |
| 11404349 | Multi-chip packages and sinterable paste for use with thermal interface materials | Nachiket R. Raravikar, Ravindranath V. Mahajan, James C. Matayabas, Jr., Ken Hackenberg, Nayandeep K. Mahanta +1 more | 2022-08-02 |
| 11355849 | Antenna package using ball attach array to connect antenna and base substrates | Jimin Yao, Shawna M. Liff, William J. Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali | 2022-06-07 |
| 11348911 | Multi-chip packaging | Sairam Agraharam, Shengquan Ou, Thomas J. De Bonis, Todd Spencer, Yang Sun +1 more | 2022-05-31 |
| 11328968 | Stacked die cavity package | Mitul Modi, Debendra Mallik, Ravindranath V. Mahajan, Amruthavalli Pallavi Alur, Yikang Deng +1 more | 2022-05-10 |
| 11276630 | Planar integrated circuit package interconnects | Sanka Ganesan | 2022-03-15 |
| 11257804 | Distributed semiconductor die and package architecture | Wilfred Gomes, Mark Bohr, Rajesh Kumar, Ravindranath V. Mahajan, Wesley D. Mc Cullough | 2022-02-22 |
| 11257688 | Embedded semiconductive chips in reconstituted wafers, and systems containing same | John S. Guzek | 2022-02-22 |
| 11227825 | High performance integrated RF passives using dual lithography process | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, William J. Lambert, Aleksandar Aleksov +6 more | 2022-01-18 |
| 11222877 | Thermally coupled package-on-package semiconductor packages | Omkar G. Karhade, Nitin A. Deshpande, Mitul Modi, Thomas J. De Bonis, Robert M. Nickerson +6 more | 2022-01-11 |