| 11521923 |
Integrated circuit package supports |
Kevin Thomas McCarthy |
2022-12-06 |
| 11515232 |
Liquid cooling through conductive interconnect |
Chia-Pin Chiu, Pooya Tadayon |
2022-11-29 |
| 11444033 |
Hybrid microelectronic substrate and methods for fabricating the same |
Robert Starkston, Scott M. Mokler, Richard C. Stamey |
2022-09-13 |
| 11430740 |
Microelectronic device with embedded die substrate on interposer |
Robert Alan May, Islam A. Salama, Sri Ranga Sai Boyapati, Sheng Li, Kristof Darmawikarta +1 more |
2022-08-30 |
| 11430724 |
Ultra-thin, hyper-density semiconductor packages |
Debendra Mallik, Robert M. Nickerson, Mitul Modi, Sanka Ganesan, Rajasekaran Swaminathan +4 more |
2022-08-30 |
| 11410919 |
Stacked silicon die architecture with mixed flipcip and wirebond interconnect |
Sanka Ganesan |
2022-08-09 |
| 11404349 |
Multi-chip packages and sinterable paste for use with thermal interface materials |
Nachiket R. Raravikar, Ravindranath V. Mahajan, James C. Matayabas, Jr., Ken Hackenberg, Nayandeep K. Mahanta +1 more |
2022-08-02 |
| 11355849 |
Antenna package using ball attach array to connect antenna and base substrates |
Jimin Yao, Shawna M. Liff, William J. Lambert, Zhichao Zhang, Sri Chaitra Jyotsna Chavali |
2022-06-07 |
| 11348911 |
Multi-chip packaging |
Sairam Agraharam, Shengquan Ou, Thomas J. De Bonis, Todd Spencer, Yang Sun +1 more |
2022-05-31 |
| 11328968 |
Stacked die cavity package |
Mitul Modi, Debendra Mallik, Ravindranath V. Mahajan, Amruthavalli Pallavi Alur, Yikang Deng +1 more |
2022-05-10 |
| 11276630 |
Planar integrated circuit package interconnects |
Sanka Ganesan |
2022-03-15 |
| 11257804 |
Distributed semiconductor die and package architecture |
Wilfred Gomes, Mark Bohr, Rajesh Kumar, Ravindranath V. Mahajan, Wesley D. Mc Cullough |
2022-02-22 |
| 11257688 |
Embedded semiconductive chips in reconstituted wafers, and systems containing same |
John S. Guzek |
2022-02-22 |
| 11227825 |
High performance integrated RF passives using dual lithography process |
Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, William J. Lambert, Aleksandar Aleksov +6 more |
2022-01-18 |
| 11222877 |
Thermally coupled package-on-package semiconductor packages |
Omkar G. Karhade, Nitin A. Deshpande, Mitul Modi, Thomas J. De Bonis, Robert M. Nickerson +6 more |
2022-01-11 |