Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Hybrid microelectronic substrate and methods for fabricating the same

Hybrid microelectronic substrate and methods for fabricating the same

US Patent 11444033 · Granted Sep 13, 2022

Estimated economic value: $14,653,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Ultra-thin, hyper-density semiconductor packages2025
Multi-chip packaging2025
Ultra-thin, hyper-density semiconductor packages2025
Planar integrated circuit package interconnects2025
Semiconductor device stack-up with bulk substrate material to mitigate hot spots2025
Substrateless double-sided embedded multi-die interconnect bridge2025
Coreless electronic substrates having embedded inductors2025
Inorganic-based embedded-die layers for modular semiconductive devices2025
Heterogeneous nested interposer package for IC chips2025
Embedded die architecture and method of making2025
Heterogeneous nested interposer package for IC chips2025
Multi-chip packaging2025