Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11522291 | Antenna boards and communication devices | Omkar G. Karhade, Xiaoqian Li, Nitin A. Deshpande, Debendra Mallik | 2022-12-06 |
| 11380652 | Multi-level distributed clamps | Beomseok Choi, Kaladhar Radhakrishnan, Michael J. Hill, Krishna Bharath | 2022-07-05 |
| 11380979 | Antenna modules and communication devices | Sidharth Dalmia, Jonathan Jensen, Ozgur Inac, Trang Thai, Benjamin Jann | 2022-07-05 |
| 11355849 | Antenna package using ball attach array to connect antenna and base substrates | Jimin Yao, Shawna M. Liff, Zhichao Zhang, Robert L. Sankman, Sri Chaitra Jyotsna Chavali | 2022-06-07 |
| 11335620 | Package inductor having thermal solution structures | Michael J. Hill, Anne Augustine, Huong Do | 2022-05-17 |
| 11335618 | Thermals for packages with inductors | — | 2022-05-17 |
| 11227825 | High performance integrated RF passives using dual lithography process | Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Robert L. Sankman, Aleksandar Aleksov +6 more | 2022-01-18 |
| 11215662 | Method, device and system to protect circuitry during a burn-in process | Kaladhar Radhakrishnan, Michael J. Hill | 2022-01-04 |