| 11462463 |
Microelectronic assemblies having an integrated voltage regulator chiplet |
Adel A. Elsherbini, Krishna Bharath, Shawna M. Liff, Johanna M. Swan |
2022-10-04 |
| 11450560 |
Microelectronic assemblies having magnetic core inductors |
Krishna Bharath, Adel A. Elsherbini, Shawna M. Liff, Zhiguo Qian, Johanna M. Swan |
2022-09-20 |
| 11437294 |
Structures to facilitate heat transfer within package layers to thermal heat sink and motherboard |
Sameer Shekhar, Amit Jain, Jonathan P. Douglas, Chin Lee Kuan |
2022-09-06 |
| 11404364 |
Multi-layer embedded magnetic inductor coil |
Huong Do, Krishna Bharath, Yikang Deng, Amruthavalli Pallavi Alur |
2022-08-02 |
| 11393751 |
Package-integrated multi-turn coil embedded in a package magnetic core |
Huong Do, Krishna Bharath, Yikang Deng, Amruthavalli Pallavi Alur |
2022-07-19 |
| 11380652 |
Multi-level distributed clamps |
Beomseok Choi, William J. Lambert, Michael J. Hill, Krishna Bharath |
2022-07-05 |
| 11335616 |
Substrate integrated inductor with composite magnetic resin layer |
Malavarayan Sankarasubramanian, Yongki Min, Ashay Dani |
2022-05-17 |
| 11215662 |
Method, device and system to protect circuitry during a burn-in process |
William J. Lambert, Michael J. Hill |
2022-01-04 |