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Microelectronic assemblies having a cooling channel |
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Effective heat conduction from hotspot to heat spreader through package substrate |
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Magnetic bilayer structure for a cored or coreless semiconductor package |
Jonathan L. Rosch, Andrew J. Brown, Junnan Zhao |
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Thermal management solutions for integrated circuit packages |
Cheng Xu, Junnan Zhao, Zhimin Wan, Ying Wang, Chong Zhang +3 more |
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Magnetic structures in integrated circuit packages |
Andrew J. Brown, Ying Wang, Chong Zhang, Lauren A. Link |
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Multi-layer embedded magnetic inductor coil |
Huong Do, Kaladhar Radhakrishnan, Krishna Bharath, Amruthavalli Pallavi Alur |
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Package-integrated multi-turn coil embedded in a package magnetic core |
Huong Do, Kaladhar Radhakrishnan, Krishna Bharath, Amruthavalli Pallavi Alur |
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Phase change material in substrate cavity |
Cheng Xu, Zhimin Wan, Junnan Zhao, Chong Zhang, Chandra Mohan Jha +2 more |
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Microelectronic assemblies having conductive structures with different thicknesses on a core substrate |
Cheng Xu, Jiwei Sun, Ji-Yong Park, Kyu Oh Lee, Zhichao Zhang +2 more |
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| 11328968 |
Stacked die cavity package |
Mitul Modi, Robert L. Sankman, Debendra Mallik, Ravindranath V. Mahajan, Amruthavalli Pallavi Alur +1 more |
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Techniques for an inductor at a first level interface |
Cheng Xu, Kyu Oh Lee, Ji-Yong Park, Srinivas V. Pietambaram, Ying Wang +3 more |
2022-05-03 |
| 11272619 |
Apparatus with embedded fine line space in a cavity, and a method for forming the same |
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Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate |
Chong Zhang, Ying Wang, Junnan Zhao, Cheng Xu |
2022-02-08 |