Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502017 | Effective heat conduction from hotspot to heat spreader through package substrate | Cheng Xu, Zhimin Wan, Yikang Deng, Junnan Zhao, Chandra Mohan Jha +1 more | 2022-11-15 |