Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521914 | Microelectronic assemblies having a cooling channel | Cheng Xu, Yikang Deng, Junnan Zhao, Ying Wang, Chong Zhang +3 more | 2022-12-06 |
| 11502017 | Effective heat conduction from hotspot to heat spreader through package substrate | Cheng Xu, Lingtao Liu, Yikang Deng, Junnan Zhao, Chandra Mohan Jha +1 more | 2022-11-15 |
| 11482471 | Thermal management solutions for integrated circuit packages | Cheng Xu, Junnan Zhao, Ying Wang, Yikang Deng, Chong Zhang +3 more | 2022-10-25 |
| 11456232 | Thermal assemblies for multi-chip packages | Je-Young Chang, Chia-Pin Chiu, Shankar Devasenathipathy, Betsegaw K. Gebrehiwot, Chandra Mohan Jha | 2022-09-27 |
| 11444003 | Integrated heat spreader with multiple channels for multichip packages | Chia-Pin Chiu, Chandra Mohan Jha, Weihua Tang, Shankar Devasenathipathy | 2022-09-13 |
| 11398414 | Sloped metal features for cooling hotspots in stacked-die packages | Chia-Pin Chiu, Pooya Tadayon, Joe Walczyk, Chandra Mohan Jha, Weihua Tang +2 more | 2022-07-26 |
| 11387224 | Phase change material in substrate cavity | Cheng Xu, Yikang Deng, Junnan Zhao, Chong Zhang, Chandra Mohan Jha +2 more | 2022-07-12 |
| 11222877 | Thermally coupled package-on-package semiconductor packages | Omkar G. Karhade, Robert L. Sankman, Nitin A. Deshpande, Mitul Modi, Thomas J. De Bonis +6 more | 2022-01-11 |