Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11398414 | Sloped metal features for cooling hotspots in stacked-die packages | Zhimin Wan, Chia-Pin Chiu, Pooya Tadayon, Chandra Mohan Jha, Weihua Tang +2 more | 2022-07-26 | $27,041,000 |
| 11372023 | Slip-plane MEMs probe for high-density and fine pitch interconnects | Pooya Tadayon | 2022-06-28 | $15,065,000 |
| 11249113 | High density and fine pitch interconnect structures in an electric test apparatus | Pooya Tadayon, Mark Bohr | 2022-02-15 | $14,138,000 |