| 11521914 |
Microelectronic assemblies having a cooling channel |
Zhimin Wan, Cheng Xu, Yikang Deng, Junnan Zhao, Ying Wang +3 more |
2022-12-06 |
| 11515232 |
Liquid cooling through conductive interconnect |
Robert L. Sankman, Pooya Tadayon |
2022-11-29 |
| 11515248 |
Localized high density substrate routing |
Robert Starkston, Debendra Mallik, John S. Guzek, Deepak Kulkarni, Ravi Mahajan |
2022-11-29 |
| 11456232 |
Thermal assemblies for multi-chip packages |
Zhimin Wan, Je-Young Chang, Shankar Devasenathipathy, Betsegaw K. Gebrehiwot, Chandra Mohan Jha |
2022-09-27 |
| 11444003 |
Integrated heat spreader with multiple channels for multichip packages |
Zhimin Wan, Chandra Mohan Jha, Weihua Tang, Shankar Devasenathipathy |
2022-09-13 |
| 11398414 |
Sloped metal features for cooling hotspots in stacked-die packages |
Zhimin Wan, Pooya Tadayon, Joe Walczyk, Chandra Mohan Jha, Weihua Tang +2 more |
2022-07-26 |
| 11251150 |
High density substrate routing in package |
Weng Hong Teh |
2022-02-15 |