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Dual strip backside metallization for improved alt-FLI plating, KOZ minimization, test enhancement and warpage control |
Nicholas S. Haehn, Edvin Cetegen |
2022-11-15 |
| 11456232 |
Thermal assemblies for multi-chip packages |
Zhimin Wan, Je-Young Chang, Chia-Pin Chiu, Betsegaw K. Gebrehiwot, Chandra Mohan Jha |
2022-09-27 |
| 11444003 |
Integrated heat spreader with multiple channels for multichip packages |
Zhimin Wan, Chia-Pin Chiu, Chandra Mohan Jha, Weihua Tang |
2022-09-13 |
| 11398414 |
Sloped metal features for cooling hotspots in stacked-die packages |
Zhimin Wan, Chia-Pin Chiu, Pooya Tadayon, Joe Walczyk, Chandra Mohan Jha +2 more |
2022-07-26 |
| 11322456 |
Die back side structures for warpage control |
Feras Eid, Venkata Suresh R. Guthikonda, Chandra Mohan Jha, Je-Young Chang, Kyle Yazzie +2 more |
2022-05-03 |