Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502008 | Dual strip backside metallization for improved alt-FLI plating, KOZ minimization, test enhancement and warpage control | Nicholas S. Haehn, Edvin Cetegen | 2022-11-15 |
| 11456232 | Thermal assemblies for multi-chip packages | Zhimin Wan, Je-Young Chang, Chia-Pin Chiu, Betsegaw K. Gebrehiwot, Chandra Mohan Jha | 2022-09-27 |
| 11444003 | Integrated heat spreader with multiple channels for multichip packages | Zhimin Wan, Chia-Pin Chiu, Chandra Mohan Jha, Weihua Tang | 2022-09-13 |
| 11398414 | Sloped metal features for cooling hotspots in stacked-die packages | Zhimin Wan, Chia-Pin Chiu, Pooya Tadayon, Joe Walczyk, Chandra Mohan Jha +2 more | 2022-07-26 |
| 11322456 | Die back side structures for warpage control | Feras Eid, Venkata Suresh R. Guthikonda, Chandra Mohan Jha, Je-Young Chang, Kyle Yazzie +2 more | 2022-05-03 |