Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11327050 | Mechanical failure monitoring, detection, and classification in electronic assemblies | Rajesh Kumar Neerukatti, Naga Sivakumar Yagnamurthy, David C. McCoy, Pramod Malatkar, Frank P. Prieto | 2022-05-10 |
| 11322455 | Robust mold integrated substrate | Jimin Yao, Shawna M. Liff | 2022-05-03 |
| 11322456 | Die back side structures for warpage control | Feras Eid, Venkata Suresh R. Guthikonda, Shankar Devasenathipathy, Chandra Mohan Jha, Je-Young Chang +2 more | 2022-05-03 |