Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11387175 | Interposer package-on-package (PoP) with solder array thermal contacts | Debendra Mallik, Sanka Ganesan, Pilin Liu, Shawna M. Liff, Sri Chaitra Jyotsna Chavali +2 more | 2022-07-12 |
| 11355849 | Antenna package using ball attach array to connect antenna and base substrates | Shawna M. Liff, William J. Lambert, Zhichao Zhang, Robert L. Sankman, Sri Chaitra Jyotsna Chavali | 2022-06-07 |
| 11322455 | Robust mold integrated substrate | Kyle Yazzie, Shawna M. Liff | 2022-05-03 |