| 11522291 |
Antenna boards and communication devices |
Omkar G. Karhade, William J. Lambert, Xiaoqian Li, Nitin A. Deshpande |
2022-12-06 |
| 11515248 |
Localized high density substrate routing |
Robert Starkston, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan |
2022-11-29 |
| 11430724 |
Ultra-thin, hyper-density semiconductor packages |
Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Sanka Ganesan, Rajasekaran Swaminathan +4 more |
2022-08-30 |
| 11417630 |
Semiconductor package having passive support wafer |
Digvijay A. Raorane, Ravindranath V. Mahajan, Mitul Modi |
2022-08-16 |
| 11387175 |
Interposer package-on-package (PoP) with solder array thermal contacts |
Sanka Ganesan, Pilin Liu, Shawna M. Liff, Sri Chaitra Jyotsna Chavali, Sandeep Gaan +2 more |
2022-07-12 |
| 11328937 |
Low cost package warpage solution |
Omkar G. Karhade, Nitin A. Deshpande, Bassam M. Ziadeh, Yoshihiro Tomita |
2022-05-10 |
| 11328968 |
Stacked die cavity package |
Mitul Modi, Robert L. Sankman, Ravindranath V. Mahajan, Amruthavalli Pallavi Alur, Yikang Deng +1 more |
2022-05-10 |
