Debendra Mallik — 7 Patents at Intel

Issued Patents 2022

Showing 1–7 of 7 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11522291	Antenna boards and communication devices	Omkar G. Karhade, William J. Lambert, Xiaoqian Li, Nitin A. Deshpande	2022-12-06	$14,727,000
11515248	Localized high density substrate routing	Robert Starkston, John S. Guzek, Chia-Pin Chiu, Deepak Kulkarni, Ravi Mahajan	2022-11-29	$14,086,000
11430724	Ultra-thin, hyper-density semiconductor packages	Robert L. Sankman, Robert M. Nickerson, Mitul Modi, Sanka Ganesan, Rajasekaran Swaminathan +4 more	2022-08-30	$13,077,000
11417630	Semiconductor package having passive support wafer	Digvijay A. Raorane, Ravindranath V. Mahajan, Mitul Modi	2022-08-16	$17,788,000
11387175	Interposer package-on-package (PoP) with solder array thermal contacts	Sanka Ganesan, Pilin Liu, Shawna M. Liff, Sri Chaitra Jyotsna Chavali, Sandeep Gaan +2 more	2022-07-12	$13,106,000
11328937	Low cost package warpage solution	Omkar G. Karhade, Nitin A. Deshpande, Bassam M. Ziadeh, Yoshihiro Tomita	2022-05-10	$19,182,000
11328968	Stacked die cavity package	Mitul Modi, Robert L. Sankman, Ravindranath V. Mahajan, Amruthavalli Pallavi Alur, Yikang Deng +1 more	2022-05-10	$19,182,000