Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527489 | Apparatus and system with package stiffening magnetic inductor core and methods of making the same | Michael J. Hill, Mathew J. Manusharow, Beomseok Choi | 2022-12-13 |
| 11488880 | Enclosure for an electronic component | Vijay K. Nair | 2022-11-01 |
| 11417630 | Semiconductor package having passive support wafer | Debendra Mallik, Ravindranath V. Mahajan, Mitul Modi | 2022-08-16 |
| 11322457 | Control of warpage using ABF GC cavity for embedded die package | Ian En Yoon Chin, Daniel N. Sobieski | 2022-05-03 |
| 11239186 | Die with embedded communication cavity | Vijay K. Nair | 2022-02-01 |