Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488880 | Enclosure for an electronic component | Digvijay A. Raorane | 2022-11-01 |
| 11456721 | RF front end module including hybrid filter and active circuits in a single package | Feras Eid, Telesphor Kamgaing, Georgios Dogiamis, Johanna M. Swan | 2022-09-27 |
| 11387200 | Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric | Georgios Dogiamis, Telesphor Kamgaing, Javier A. Falcon, Yoshihiro Tomita | 2022-07-12 |
| 11367708 | Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabric | Georgios Dogiamis, Telesphor Kamgaing | 2022-06-21 |
| 11335651 | Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabric | Telesphor Kamgaing, Georgios Dogiamis, Javier A. Falcon, Shawna M. Liff, Yoshihiro Tomita | 2022-05-17 |
| 11283427 | Hybrid filters and packages therefor | Telesphor Kamgaing, Feras Eid, Georgios Dogiamis, Johanna M. Swan | 2022-03-22 |
| 11239186 | Die with embedded communication cavity | Digvijay A. Raorane | 2022-02-01 |