| 11538758 |
Waveguide interconnect bridges |
Johanna M. Swan |
2022-12-27 |
| 11532574 |
Through-substrate waveguide |
Aleksandar Aleksov, Telesphor Kamgaing, Gilbert Dewey, Hyung-Jin Lee |
2022-12-20 |
| 11476554 |
Mmwave waveguide to waveguide connectors for automotive applications |
Sasha N. Oster, Telesphor Kamgaing, Erich N. Ewy, Adel A. Elsherbini, Johanna M. Swan |
2022-10-18 |
| 11462810 |
Multiplexer and combiner structures embedded in a mmwave connector interface |
Telesphor Kamgaing, Sasha N. Oster, Johanna M. Swan |
2022-10-04 |
| 11456721 |
RF front end module including hybrid filter and active circuits in a single package |
Feras Eid, Telesphor Kamgaing, Vijay K. Nair, Johanna M. Swan |
2022-09-27 |
| 11437693 |
Mmwave waveguides featuring power-over-waveguide technology for automotive applications |
Sasha N. Oster, Telesphor Kamgaing, Kenneth D. Shoemaker, Erich N. Ewy, Adel A. Elsherbini +1 more |
2022-09-06 |
| 11437706 |
Package with side-radiating wave launcher and waveguide |
Aleksandar Aleksov, Telesphor Kamgaing, Gilbert Dewey, Hyung-Jin Lee |
2022-09-06 |
| 11430751 |
Microelectronic devices designed with 3D stacked ultra thin package modules for high frequency communications |
Aleksandar Aleksov, Telesphor Kamgaing, Sasha N. Oster |
2022-08-30 |
| 11394094 |
Waveguide connector having a curved array of waveguides configured to connect a package to excitation elements |
Telesphor Kamgaing, Sasha N. Oster, Adel A. Elsherbini, Shawna M. Liff, Aleksandar Aleksov +2 more |
2022-07-19 |
| 11387200 |
Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric |
Telesphor Kamgaing, Javier A. Falcon, Yoshihiro Tomita, Vijay K. Nair |
2022-07-12 |
| 11380624 |
Electromagnetic interference shield created on package using high throughput additive manufacturing |
Feras Eid, Henning Braunisch, Shawna M. Liff, Johanna M. Swan |
2022-07-05 |
| 11367708 |
Microelectronic devices designed with efficient partitioning of high frequency communication devices integrated on a package fabric |
Vijay K. Nair, Telesphor Kamgaing |
2022-06-21 |
| 11367937 |
Waveguides with active or passive repeaters for range extension |
Sasha N. Oster, Telesphor Kamgaing |
2022-06-21 |
| 11335651 |
Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabric |
Telesphor Kamgaing, Vijay K. Nair, Javier A. Falcon, Shawna M. Liff, Yoshihiro Tomita |
2022-05-17 |
| 11329359 |
Dielectric waveguide including a dielectric material with cavities therein surrounded by a conductive coating forming a wall for the cavities |
Adel A. Elsherbini, Telesphor Kamgaing, Henning Braunisch, Johanna M. Swan |
2022-05-10 |
| 11328986 |
Capacitor-wirebond pad structures for integrated circuit packages |
Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Johanna M. Swan |
2022-05-10 |
| 11316497 |
Multi-filter die |
Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Johanna M. Swan |
2022-04-26 |
| 11309619 |
Waveguide coupling systems and methods |
Sasha N. Oster, Telesphor Kamgaing, Adel A. Elsherbini, Shawna M. Liff, Aleksandar Aleksov +1 more |
2022-04-19 |
| 11310907 |
Microelectronic package with substrate-integrated components |
Aleksandar Aleksov, Feras Eid, Telesphor Kamgaing, Johanna M. Swan |
2022-04-19 |
| 11283427 |
Hybrid filters and packages therefor |
Telesphor Kamgaing, Feras Eid, Vijay K. Nair, Johanna M. Swan |
2022-03-22 |
| 11282800 |
Substrate integrated inductors using high throughput additive deposition of hybrid magnetic materials |
Henning Braunisch, Feras Eid |
2022-03-22 |
| 11264687 |
Microelectronic assemblies comprising a package substrate portion integrated with a substrate integrated waveguide filter |
Adel A. Elsherbini |
2022-03-01 |
| 11251512 |
Pluggable MM-wave module for rack scale architecture (RSA) servers and high performance computers (HPCS) |
Sasha N. Oster, Telesphor Kamgaing |
2022-02-15 |
| 11221354 |
Switched closed loop read-out methods and systems for resonant sensing platforms |
Sasha N. Oster, Feras Eid, Ian A. Young |
2022-01-11 |
| 11223524 |
Package integrated security features |
Shawna M. Liff, Adel A. Elsherbini, Sasha N. Oster, Feras Eid, Thomas L. Sounart +1 more |
2022-01-11 |