| 11495552 |
Substrate integrated thin film capacitors using amorphous high-k dielectrics |
Aleksandar Aleksov, Thomas L. Sounart, Kristof Darmawikarta, Prithwish Chatterjee, Andrew J. Brown |
2022-11-08 |
| 11460499 |
Dual sided thermal management solutions for integrated circuit packages |
Aleksandar Aleksov, Veronica Strong, Brandon M. Rawlings, Johanna M. Swan, Shawna M. Liff |
2022-10-04 |
| 11393777 |
Microelectronic assemblies |
Adel A. Elsherbini, Patrick Morrow, Kimin Jun, Brennen Mueller, Shawna M. Liff +2 more |
2022-07-19 |
| 11387187 |
Embedded very high density (VHD) layer |
Andrew Collins, Jianyong Xie, Sujit Sharan, Aleksandar Aleksov |
2022-07-12 |
| 11387188 |
High density interconnect structures configured for manufacturing and performance |
Kemal Aygun, Ajay Jain, Zhiguo Qian |
2022-07-12 |
| 11380624 |
Electromagnetic interference shield created on package using high throughput additive manufacturing |
Feras Eid, Shawna M. Liff, Georgios Dogiamis, Johanna M. Swan |
2022-07-05 |
| 11348897 |
Microelectronic assemblies |
Adel A. Elsherbini, Aleksandar Aleksov, Shawna M. Liff, Johanna M. Swan, Patrick Morrow +3 more |
2022-05-31 |
| 11329359 |
Dielectric waveguide including a dielectric material with cavities therein surrounded by a conductive coating forming a wall for the cavities |
Georgios Dogiamis, Adel A. Elsherbini, Telesphor Kamgaing, Johanna M. Swan |
2022-05-10 |
| 11329358 |
Low loss and low cross talk transmission lines having l-shaped cross sections |
Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen +3 more |
2022-05-10 |
| 11282800 |
Substrate integrated inductors using high throughput additive deposition of hybrid magnetic materials |
Feras Eid, Georgios Dogiamis |
2022-03-22 |
| 11222847 |
Enabling long interconnect bridges |
Ravindranath V. Mahajan, Zhiguo Qian, Kemal Aygun, Sujit Sharan |
2022-01-11 |