Issued Patents 2022
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527501 | Sacrificial redistribution layer in microelectronic assemblies having direct bonding | Adel A. Elsherbini, Shawna M. Liff, Brandon M. Rawlings, Jagat Shakya, Johanna M. Swan +3 more | 2022-12-13 |
| 11502037 | Zero-misalignment two-via structures using photoimageable dielectric, buildup film, and electrolytic plating | Aleksandar Aleksov, Brandon M. Rawlings | 2022-11-15 |
| 11460499 | Dual sided thermal management solutions for integrated circuit packages | Henning Braunisch, Aleksandar Aleksov, Brandon M. Rawlings, Johanna M. Swan, Shawna M. Liff | 2022-10-04 |
| 11424239 | Diodes for package substrate electrostatic discharge (ESD) protection | Aleksandar Aleksov, Adel A. Elsherbini, Feras Eid, Johanna M. Swan | 2022-08-23 |
| 11397173 | Interconnected corrugated carbon-based network | Maher F. El-Kady, Richard B. Kaner | 2022-07-26 |
| 11348882 | Package spark gap structure | Aleksandar Aleksov, Feras Eid, Johanna M. Swan, Adel A. Elsherbini | 2022-05-31 |
| 11328996 | Zero-misalignment two-via structures using photoimageable dielectric film buildup film, and transparent substrate with electroless plating | Aleksandar Aleksov, Brandon M. Rawlings | 2022-05-10 |
| 11296040 | Electrostatic discharge protection in integrated circuits | Adel A. Elsherbini, Feras Eid, Johanna M. Swan, Aleksandar Aleksov | 2022-04-05 |
| 11289431 | Electrostatic discharge protection in integrated circuits using materials with optically controlled electrical conductivity | Feras Eid, Aleksandar Aleksov, Adel A. Elsherbini, Johanna M. Swan | 2022-03-29 |
| 11264373 | Die backend diodes for electrostatic discharge (ESD) protection | Aleksandar Aleksov, Adel A. Elsherbini, Feras Eid, Johanna M. Swan | 2022-03-01 |
| 11257745 | Electroless metal-defined thin pad first level interconnects for lithographically defined vias | Aleksandar Aleksov, Kristof Darmawikarta, Arnab Sarkar | 2022-02-22 |
| 11257632 | Capacitor with electrodes made of an interconnected corrugated carbon-based network | Maher F. El-Kady, Richard B. Kaner | 2022-02-22 |
| 11239155 | Conductive contact structures for electrostatic discharge protection in integrated circuits | Adel A. Elsherbini, Feras Eid, Johanna M. Swan, Aleksandar Aleksov | 2022-02-01 |
| 11222856 | Package-integrated bistable switch for electrostatic discharge (ESD) protection | Feras Eid, Aleksandar Aleksov, Adel A. Elsherbini, Johanna M. Swan | 2022-01-11 |
| 11222836 | Zero-misalignment two-via structures | Aleksandar Aleksov, Brandon M. Rawlings, Johanna M. Swan | 2022-01-11 |