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Dual sided thermal management solutions for integrated circuit packages |
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Waveguide connector having a curved array of waveguides configured to connect a package to excitation elements |
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Zero-misalignment two-via structures using photoimageable dielectric film buildup film, and transparent substrate with electroless plating |
Veronica Strong, Aleksandar Aleksov |
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High performance integrated RF passives using dual lithography process |
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Zero-misalignment two-via structures |
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