Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527501 | Sacrificial redistribution layer in microelectronic assemblies having direct bonding | Adel A. Elsherbini, Veronica Strong, Shawna M. Liff, Brandon M. Rawlings, Johanna M. Swan +3 more | 2022-12-13 |
| 11486923 | Apparatuses and methods for mitigating sticking of units-under-test | Ethan Caughey, Jeremy Alan Streifer | 2022-11-01 |