Issued Patents 2022
Showing 1–25 of 62 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538758 | Waveguide interconnect bridges | Georgios Dogiamis | 2022-12-27 |
| 11527501 | Sacrificial redistribution layer in microelectronic assemblies having direct bonding | Adel A. Elsherbini, Veronica Strong, Shawna M. Liff, Brandon M. Rawlings, Jagat Shakya +3 more | 2022-12-13 |
| 11508587 | Microelectronic assemblies | Adel A. Elsherbini, Shawna M. Liff | 2022-11-22 |
| 11482472 | Thermal management solutions for stacked integrated circuit devices | Feras Eid, Adel A. Elsherbini | 2022-10-25 |
| 11476554 | Mmwave waveguide to waveguide connectors for automotive applications | Georgios Dogiamis, Sasha N. Oster, Telesphor Kamgaing, Erich N. Ewy, Adel A. Elsherbini | 2022-10-18 |
| 11469209 | Microelectronic assemblies | Shawna M. Liff, Adel A. Elsherbini | 2022-10-11 |
| 11469206 | Microelectronic assemblies | Adel A. Elsherbini, Feras Eid, Shawna M. Lift | 2022-10-11 |
| 11462463 | Microelectronic assemblies having an integrated voltage regulator chiplet | Adel A. Elsherbini, Kaladhar Radhakrishnan, Krishna Bharath, Shawna M. Liff | 2022-10-04 |
| 11462480 | Microelectronic assemblies having interposers | Aleksandar Aleksov | 2022-10-04 |
| 11462810 | Multiplexer and combiner structures embedded in a mmwave connector interface | Telesphor Kamgaing, Sasha N. Oster, Georgios Dogiamis | 2022-10-04 |
| 11460499 | Dual sided thermal management solutions for integrated circuit packages | Henning Braunisch, Aleksandar Aleksov, Veronica Strong, Brandon M. Rawlings, Shawna M. Liff | 2022-10-04 |
| 11456721 | RF front end module including hybrid filter and active circuits in a single package | Feras Eid, Telesphor Kamgaing, Georgios Dogiamis, Vijay K. Nair | 2022-09-27 |
| 11450560 | Microelectronic assemblies having magnetic core inductors | Krishna Bharath, Adel A. Elsherbini, Shawna M. Liff, Kaladhar Radhakrishnan, Zhiguo Qian | 2022-09-20 |
| 11437693 | Mmwave waveguides featuring power-over-waveguide technology for automotive applications | Georgios Dogiamis, Sasha N. Oster, Telesphor Kamgaing, Kenneth D. Shoemaker, Erich N. Ewy +1 more | 2022-09-06 |
| 11437348 | Microelectronic assemblies with communication networks | Adel A. Elsherbini, Amr Elshazly, Arun Chandrasekhar, Shawna M. Liff | 2022-09-06 |
| 11421376 | Inorganic piezoelectric materials formed on fibers and applications thereof | Shawna M. Liff, Feras Eid, Aleksandar Aleksov, Sasha N. Oster, Baris Bicen +2 more | 2022-08-23 |
| 11422551 | Technologies for providing a cognitive capacity test for autonomous driving | Shahrnaz Azizi, Rajashree Baskaran, Melissa M. Ortiz, Fatema Adenwala, Mengjie Yu | 2022-08-23 |
| 11424239 | Diodes for package substrate electrostatic discharge (ESD) protection | Aleksandar Aleksov, Adel A. Elsherbini, Feras Eid, Veronica Strong | 2022-08-23 |
| 11417593 | Dies with integrated voltage regulators | Adel A. Elsherbini, Krishna Bharath, Shawna M. Liff | 2022-08-16 |
| 11417586 | Thermal management solutions for substrates in integrated circuit packages | Adel A. Elsherbini, Feras Eid | 2022-08-16 |
| 11393777 | Microelectronic assemblies | Adel A. Elsherbini, Patrick Morrow, Henning Braunisch, Kimin Jun, Brennen Mueller +2 more | 2022-07-19 |
| 11394094 | Waveguide connector having a curved array of waveguides configured to connect a package to excitation elements | Telesphor Kamgaing, Sasha N. Oster, Georgios Dogiamis, Adel A. Elsherbini, Shawna M. Liff +2 more | 2022-07-19 |
| 11380624 | Electromagnetic interference shield created on package using high throughput additive manufacturing | Feras Eid, Henning Braunisch, Shawna M. Liff, Georgios Dogiamis | 2022-07-05 |
| 11367689 | Microelectronic assemblies with communication networks | Adel A. Elsherbini, Amr Elshazly, Arun Chandrasekhar, Shawna M. Liff | 2022-06-21 |
| 11367707 | Semiconductor package or structure with dual-sided interposers and memory | Shawna M. Liff, Adel A. Elsherbini, Gerald Pasdast | 2022-06-21 |