| 11456281 |
Architecture and processes to enable high capacity memory packages through memory die stacking |
Yi Li, Prasad Ramanathan, Saikumar Jayaraman, Kemal Aygun, Hector Amador +3 more |
2022-09-27 |
| 11450613 |
Integrated circuit package with test circuitry for testing a channel between dies |
Mayue Xie, Jong-Ru Guo, Zuoguo Wu |
2022-09-20 |
| 11450560 |
Microelectronic assemblies having magnetic core inductors |
Krishna Bharath, Adel A. Elsherbini, Shawna M. Liff, Kaladhar Radhakrishnan, Johanna M. Swan |
2022-09-20 |
| 11387188 |
High density interconnect structures configured for manufacturing and performance |
Henning Braunisch, Kemal Aygun, Ajay Jain |
2022-07-12 |
| 11296031 |
Dielectric-filled trench isolation of vias |
Kemal Aygun, Jianyong Xie |
2022-04-05 |
| 11276635 |
Horizontal pitch translation using embedded bridge dies |
Sujit Sharan, Kemal Aygun, Yidnekachew S. Mekonnen, Zhichao Zhang, Jianyong Xie |
2022-03-15 |
| 11244890 |
Ground via clustering for crosstalk mitigation |
Kemal Aygun, Yu Zhang |
2022-02-08 |
| 11222847 |
Enabling long interconnect bridges |
Ravindranath V. Mahajan, Henning Braunisch, Kemal Aygun, Sujit Sharan |
2022-01-11 |
| 11222848 |
Power delivery for embedded bridge die utilizing trench structures |
Kemal Aygun, Jianyong Xie |
2022-01-11 |