Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462521 | Multilevel die complex with integrated discrete passive components | Andrew Collins, Jianyong Xie | 2022-10-04 |
| 11387187 | Embedded very high density (VHD) layer | Andrew Collins, Jianyong Xie, Henning Braunisch, Aleksandar Aleksov | 2022-07-12 |
| 11380643 | Rounded metal trace corner for stress reduction | Dae-Woo Kim, Ajay Jain, Neha M. Patel, Rodrick J. Hendricks | 2022-07-05 |
| 11355427 | Device, method and system for providing recessed interconnect structures of a substrate | Howe Yin Loo, Tin Poay Chuah, Ananth Prabhakumar | 2022-06-07 |
| 11322445 | EMIB copper layer for signal and power routing | Yidnekachew S. Mekonnen, Dae-Woo Kim, Kemal Aygun | 2022-05-03 |
| 11276635 | Horizontal pitch translation using embedded bridge dies | Kemal Aygun, Zhiguo Qian, Yidnekachew S. Mekonnen, Zhichao Zhang, Jianyong Xie | 2022-03-15 |
| 11257743 | Guard ring design enabling in-line testing of silicon bridges for semiconductor packages | Arnab Sarkar, Dae-Woo Kim | 2022-02-22 |
| 11222837 | Low-inductance current paths for on-package power distributions and methods of assembling same | Andrew Collins, Jianyong Xie | 2022-01-11 |
| 11222847 | Enabling long interconnect bridges | Ravindranath V. Mahajan, Zhiguo Qian, Henning Braunisch, Kemal Aygun | 2022-01-11 |