Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462521 | Multilevel die complex with integrated discrete passive components | Andrew Collins, Sujit Sharan | 2022-10-04 |
| 11456281 | Architecture and processes to enable high capacity memory packages through memory die stacking | Yi Li, Zhiguo Qian, Prasad Ramanathan, Saikumar Jayaraman, Kemal Aygun +3 more | 2022-09-27 |
| 11387187 | Embedded very high density (VHD) layer | Andrew Collins, Sujit Sharan, Henning Braunisch, Aleksandar Aleksov | 2022-07-12 |
| 11296031 | Dielectric-filled trench isolation of vias | Kemal Aygun, Zhiguo Qian | 2022-04-05 |
| 11276635 | Horizontal pitch translation using embedded bridge dies | Sujit Sharan, Kemal Aygun, Zhiguo Qian, Yidnekachew S. Mekonnen, Zhichao Zhang | 2022-03-15 |
| 11222837 | Low-inductance current paths for on-package power distributions and methods of assembling same | Andrew Collins, Sujit Sharan | 2022-01-11 |
| 11222848 | Power delivery for embedded bridge die utilizing trench structures | Kemal Aygun, Zhiguo Qian | 2022-01-11 |