Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462521 | Multilevel die complex with integrated discrete passive components | Jianyong Xie, Sujit Sharan | 2022-10-04 |
| 11456281 | Architecture and processes to enable high capacity memory packages through memory die stacking | Yi Li, Zhiguo Qian, Prasad Ramanathan, Saikumar Jayaraman, Kemal Aygun +3 more | 2022-09-27 |
| 11387187 | Embedded very high density (VHD) layer | Jianyong Xie, Sujit Sharan, Henning Braunisch, Aleksandar Aleksov | 2022-07-12 |
| 11270942 | Pitch translation architecture for semiconductor package including embedded interconnect bridge | Bharat P. Penmecha, Rajasekaran Swaminathan, Ram Viswanath | 2022-03-08 |
| 11222837 | Low-inductance current paths for on-package power distributions and methods of assembling same | Jianyong Xie, Sujit Sharan | 2022-01-11 |