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Density-graded adhesion layer for conductors |
Rahul N. Manepalli, Srinivas V. Pietambaram, Cemil Geyik |
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| 11456281 |
Architecture and processes to enable high capacity memory packages through memory die stacking |
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| 11450629 |
Intra-semiconductor die communication via waveguide in a multi-die semiconductor package |
Zhi Qian, Jian Yong XIE |
2022-09-20 |
| 11437366 |
Tunable passive semiconductor elements |
Zhichao Zhang, Yidnekachew S. Mekonnen |
2022-09-06 |
| 11387188 |
High density interconnect structures configured for manufacturing and performance |
Henning Braunisch, Ajay Jain, Zhiguo Qian |
2022-07-12 |
| 11322445 |
EMIB copper layer for signal and power routing |
Yidnekachew S. Mekonnen, Dae-Woo Kim, Sujit Sharan |
2022-05-03 |
| 11296031 |
Dielectric-filled trench isolation of vias |
Zhiguo Qian, Jianyong Xie |
2022-04-05 |
| 11295998 |
Stiffener and package substrate for a semiconductor package |
Stephen Christianson, Stephen H. Hall, Emile Davies-Venn, Dong-Ho Han, Konika Ganguly +4 more |
2022-04-05 |
| 11291133 |
Selective ground flood around reduced land pad on package base layer to enable high speed land grid array (LGA) socket |
Zhichao Zhang, Gregorio R. Murtagian, Kuang Liu |
2022-03-29 |
| 11276635 |
Horizontal pitch translation using embedded bridge dies |
Sujit Sharan, Zhiguo Qian, Yidnekachew S. Mekonnen, Zhichao Zhang, Jianyong Xie |
2022-03-15 |
| 11244890 |
Ground via clustering for crosstalk mitigation |
Zhiguo Qian, Yu Zhang |
2022-02-08 |
| 11222847 |
Enabling long interconnect bridges |
Ravindranath V. Mahajan, Zhiguo Qian, Henning Braunisch, Sujit Sharan |
2022-01-11 |
| 11222848 |
Power delivery for embedded bridge die utilizing trench structures |
Zhiguo Qian, Jianyong Xie |
2022-01-11 |