Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11295998 | Stiffener and package substrate for a semiconductor package | Stephen Christianson, Stephen H. Hall, Emile Davies-Venn, Kemal Aygun, Konika Ganguly +4 more | 2022-04-05 |
| 11263530 | Apparatus for operations at maxout layer of neural networks | Qi Guo, Tianshi Chen, Yunji Chen | 2022-03-01 |
| 11227716 | Inductor | Young Min Hur, Bourn Seock Kim | 2022-01-18 |