Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11295998 | Stiffener and package substrate for a semiconductor package | Stephen Christianson, Emile Davies-Venn, Dong-Ho Han, Kemal Aygun, Konika Ganguly +4 more | 2022-04-05 |
| 11290059 | Crystal oscillator interconnect architecture with noise immunity | Khang Choong Yong, Raymond Chong, Ramaswamy Parthasarathy, Chin Lee Kuan | 2022-03-29 |
| 11277903 | Pattern-edged metal-plane resonance-suppression | Khang Choong Yong, Ying Ern Ho, Yun Rou Lim, Wil Choon Song | 2022-03-15 |