Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11540395 | Stacked-component placement in multiple-damascene printed wiring boards for semiconductor package substrates | Bok Eng Cheah, Jackson Chung Peng Kong | 2022-12-27 |
| 11527479 | Stepped interposer for stacked chip package | Bok Eng Cheah, Jackson Chung Peng Kong | 2022-12-13 |
| 11521943 | Method of forming a capacitive loop substrate assembly | Jenny Shio Yin Ong, Tin Poay Chuah | 2022-12-06 |
| 11502603 | Magnetic sensing scheme for voltage regulator circuit | Amit Jain, Sameer Shekhar | 2022-11-15 |
| 11437294 | Structures to facilitate heat transfer within package layers to thermal heat sink and motherboard | Sameer Shekhar, Amit Jain, Kaladhar Radhakrishnan, Jonathan P. Douglas | 2022-09-06 |
| 11380623 | Shield to protect vias from electromagnetic interference | Sameer Shekhar, Amit Jain | 2022-07-05 |
| 11342852 | Apparatus, system, and method for reducing voltage overshoot in voltage regulators | Sameer Shekhar, Amit Jain, Alexander Waizman, Michael Zelikson | 2022-05-24 |
| 11290059 | Crystal oscillator interconnect architecture with noise immunity | Khang Choong Yong, Raymond Chong, Ramaswamy Parthasarathy, Stephen H. Hall | 2022-03-29 |
| 11264160 | Extended package air core inductor | Eng Huat Goh, Jiun Hann Sir, Min Suet Lim, Siew Fong Yap | 2022-03-01 |