Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538633 | Combination stiffener and capacitor | Eng Huat Goh, Min Suet Lim | 2022-12-27 |
| 11393760 | Floating-bridge interconnects and methods of assembling same | Boon Ping Koh, Eng Huat Goh, Khang Choong Yong, Min Suet Lim, Wil Choon Song | 2022-07-19 |
| 11322434 | Top-to-bottom interconnects with molded lead-frame module for integrated-circuit packages | Poh Boon Khoo, Eng Huat Goh | 2022-05-03 |
| 11289414 | Systems, methods, and apparatuses for implementing a pad on solder mask (POSM) semiconductor substrate package | Eng Huat Goh, Min Suet Lim | 2022-03-29 |
| 11264160 | Extended package air core inductor | Eng Huat Goh, Min Suet Lim, Chin Lee Kuan, Siew Fong Yap | 2022-03-01 |
| 11264315 | Electronic package with passive component between substrates | Eng Huat Goh, Min Suet Lim, Hoay Tien Teoh, Jimmy Huang | 2022-03-01 |