Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11264315 | Electronic package with passive component between substrates | Eng Huat Goh, Min Suet Lim, Jiun Hann Sir, Hoay Tien Teoh | 2022-03-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11264315 | Electronic package with passive component between substrates | Eng Huat Goh, Min Suet Lim, Jiun Hann Sir, Hoay Tien Teoh | 2022-03-01 |