| 11538633 |
Combination stiffener and capacitor |
Eng Huat Goh, Jiun Hann Sir |
2022-12-27 |
| 11487326 |
Elevated docking station for different mobile devices |
Jeff Ku, Tin Poay Chuah, Yew San Lim, Chee Chun Yee |
2022-11-01 |
| 11481001 |
System for dual displays |
Chee Chun Yee, Tin Poay Chuah, Yew San Lim, Jeff Ku |
2022-10-25 |
| 11445608 |
Chassis interconnect for an electronic device |
Chee How Lim, Eng Huat Goh, Jon Sern Lim, Khai Ern See, Tin Poay Chuah +1 more |
2022-09-13 |
| 11393760 |
Floating-bridge interconnects and methods of assembling same |
Boon Ping Koh, Eng Huat Goh, Jiun Hann Sir, Khang Choong Yong, Wil Choon Song |
2022-07-19 |
| 11348909 |
Multi-die packages with efficient memory storage |
Maruti Gupta Hyde, Nageen Himayat, Linda L. Hurd, Van H. Le, Gayathri Jeganmohan +1 more |
2022-05-31 |
| 11343906 |
Stacked scalable voltage regulator module for platform area miniaturization |
Tai Loong Wong, Fern Nee Tan, Tin Poay Chuah, Siang Yeong Tan |
2022-05-24 |
| 11320883 |
Multi-die stacks with power management |
Rajashree Baskaran, Maruti Gupta Hyde, Van H. Le, Hebatallah Saadeldeen |
2022-05-03 |
| 11289414 |
Systems, methods, and apparatuses for implementing a pad on solder mask (POSM) semiconductor substrate package |
Eng Huat Goh, Jiun Hann Sir |
2022-03-29 |
| 11264160 |
Extended package air core inductor |
Eng Huat Goh, Jiun Hann Sir, Chin Lee Kuan, Siew Fong Yap |
2022-03-01 |
| 11264315 |
Electronic package with passive component between substrates |
Eng Huat Goh, Jiun Hann Sir, Hoay Tien Teoh, Jimmy Huang |
2022-03-01 |