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Min Suet Lim — 11 Patents in 2022

Intel: 11 patents #151 of 4,681Top 4%

Merang, MY: #4 of 26 inventorsTop 20%

Overall (2022): #6,639 of 548,613Top 2%

11 Patents 2022

Issued Patents 2022

Showing 1–11 of 11 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11538633	Combination stiffener and capacitor	Eng Huat Goh, Jiun Hann Sir	2022-12-27	$12,365,000
11487326	Elevated docking station for different mobile devices	Jeff Ku, Tin Poay Chuah, Yew San Lim, Chee Chun Yee	2022-11-01	$18,130,000
11481001	System for dual displays	Chee Chun Yee, Tin Poay Chuah, Yew San Lim, Jeff Ku	2022-10-25	$11,792,000
11445608	Chassis interconnect for an electronic device	Chee How Lim, Eng Huat Goh, Jon Sern Lim, Khai Ern See, Tin Poay Chuah +1 more	2022-09-13	$14,653,000
11393760	Floating-bridge interconnects and methods of assembling same	Boon Ping Koh, Eng Huat Goh, Jiun Hann Sir, Khang Choong Yong, Wil Choon Song	2022-07-19	$11,394,000
11348909	Multi-die packages with efficient memory storage	Maruti Gupta Hyde, Nageen Himayat, Linda L. Hurd, Van H. Le, Gayathri Jeganmohan +1 more	2022-05-31	$16,893,000
11343906	Stacked scalable voltage regulator module for platform area miniaturization	Tai Loong Wong, Fern Nee Tan, Tin Poay Chuah, Siang Yeong Tan	2022-05-24	$18,289,000
11320883	Multi-die stacks with power management	Rajashree Baskaran, Maruti Gupta Hyde, Van H. Le, Hebatallah Saadeldeen	2022-05-03	$16,346,000
11289414	Systems, methods, and apparatuses for implementing a pad on solder mask (POSM) semiconductor substrate package	Eng Huat Goh, Jiun Hann Sir	2022-03-29	$28,068,000
11264160	Extended package air core inductor	Eng Huat Goh, Jiun Hann Sir, Chin Lee Kuan, Siew Fong Yap	2022-03-01	$16,941,000
11264315	Electronic package with passive component between substrates	Eng Huat Goh, Jiun Hann Sir, Hoay Tien Teoh, Jimmy Huang	2022-03-01	$16,941,000