Issued Patents 2022
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521943 | Method of forming a capacitive loop substrate assembly | Jenny Shio Yin Ong, Chin Lee Kuan | 2022-12-06 |
| 11487326 | Elevated docking station for different mobile devices | Jeff Ku, Yew San Lim, Min Suet Lim, Chee Chun Yee | 2022-11-01 |
| 11481001 | System for dual displays | Chee Chun Yee, Yew San Lim, Min Suet Lim, Jeff Ku | 2022-10-25 |
| 11445608 | Chassis interconnect for an electronic device | Chee How Lim, Eng Huat Goh, Jon Sern Lim, Khai Ern See, Min Suet Lim +1 more | 2022-09-13 |
| 11375617 | Three dimensional foldable substrate with vertical side interface | Bok Eng Cheah, Jackson Chung Peng Kong | 2022-06-28 |
| 11355427 | Device, method and system for providing recessed interconnect structures of a substrate | Howe Yin Loo, Sujit Sharan, Ananth Prabhakumar | 2022-06-07 |
| 11343906 | Stacked scalable voltage regulator module for platform area miniaturization | Tai Loong Wong, Fern Nee Tan, Min Suet Lim, Siang Yeong Tan | 2022-05-24 |
| 11304299 | Board to board interconnect | Chee Ling Wong, Wil Choon Song, Khang Choong Yong, Eng Huat Goh, Mohd Muhaiyiddin Bin Abdullah | 2022-04-12 |