Issued Patents 2022
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11540395 | Stacked-component placement in multiple-damascene printed wiring boards for semiconductor package substrates | Jackson Chung Peng Kong, Chin Lee Kuan | 2022-12-27 |
| 11527485 | Electrical shield for stacked heterogeneous device integration | Seok Ling Lim, Jenny Shio Yin Ong, Jackson Chung Peng Kong, Kooi Chi Ooi | 2022-12-13 |
| 11527481 | Stacked semiconductor package with flyover bridge | Choong Kooi Chee, Teong Guan Yew, Jackson Chung Peng Kong, Loke Yip Foo | 2022-12-13 |
| 11527463 | Hybrid ball grid array package for high speed interconnects | Jenny Shio Yin Ong, Seok Ling Lim, Kooi Chi Ooi, Jackson Chung Peng Kong | 2022-12-13 |
| 11527479 | Stepped interposer for stacked chip package | Chin Lee Kuan, Jackson Chung Peng Kong | 2022-12-13 |
| 11527467 | Multi-chip package with extended frame | Seok Ling Lim, Jackson Chung Peng Kong, Jenny Shio Yin Ong, Kooi Chi Ooi | 2022-12-13 |
| 11521932 | Composite bridge die-to-die interconnects for integrated-circuit packages | Jackson Chung Peng Kong, Jenny Shio Yin Ong, Ping Ping Ooi, Seok Ling Lim | 2022-12-06 |
| 11508660 | Molded power delivery interconnect module for improved Imax and power integrity | Seok Ling Lim, Jenny Shio Yin Ong, Jackson Chung Peng Kong | 2022-11-22 |
| 11508650 | Interposer for hybrid interconnect geometry | Jenny Shio Yin Ong, Seok Ling Lim, Jackson Chung Peng Kong, Kooi Chi Ooi | 2022-11-22 |
| 11482481 | Semiconductor device and system | Jackson Chung Peng Kong, Kooi Chi Ooi, Lee Fueng Yap, Chan Kim Lee | 2022-10-25 |
| 11476198 | Multi-level components for integrated-circuit packages | Jackson Chung Peng Kong, Jenny Shio Yin Ong, Seok Ling Lim, Kok Keng Wan | 2022-10-18 |
| 11462488 | Substrate cores for warpage control | Seok Ling Lim, Jackson Chung Peng Kong, Jenny Shio Yin Ong | 2022-10-04 |
| 11462468 | Semiconductor package, semiconductor system, and method of forming semiconductor package | Jackson Chung Peng Kong | 2022-10-04 |
| 11456516 | Low loss high-speed interconnects | Ling Li Ong, Kin Wai Lee, Yang Liang Poh, Yean Ling Soon | 2022-09-27 |
| 11430764 | Overhang bridge interconnect | Seok Ling Lim, Jenny Shio Yin Ong, Jackson Chung Peng Kong, Kooi Chi Ooi | 2022-08-30 |
| 11411290 | Hybrid transmission line | Hungying L. Lo | 2022-08-09 |
| 11398415 | Stacked through-silicon vias for multi-device packages | Choong Kooi Chee, Jackson Chung Peng Kong, Tat Hin Tan, Wai Ling Lee | 2022-07-26 |
| 11393758 | Power delivery for embedded interconnect bridge devices and methods | Jackson Chung Peng Kong, Loke Yip Foo, Wai Ling Lee | 2022-07-19 |
| 11393741 | Micro through-silicon via for transistor density scaling | Choong Kooi Chee, Jackson Chung Peng Kong, Wai Ling Lee, Tat Hin Tan | 2022-07-19 |
| 11375617 | Three dimensional foldable substrate with vertical side interface | Tin Poay Chuah, Jackson Chung Peng Kong | 2022-06-28 |
| 11367673 | Semiconductor package with hybrid through-silicon-vias | Seok Ling Lim, Jackson Chung Peng Kong, Jenny Shio Yin Ong | 2022-06-21 |
| 11363717 | Inductor array and support | Jackson Chung Peng Kong, Ranjul Balakrishnan | 2022-06-14 |
| 11355458 | Interconnect core | Jackson Chung Peng Kong, Ping Ping Ooi, Kooi Chi Ooi | 2022-06-07 |
| 11342289 | Vertical power plane module for semiconductor packages | Jenny Shio Yin Ong, Jackson Chung Peng Kong, Seok Ling Lim, Kooi Chi Ooi | 2022-05-24 |
| 11289427 | Multi-faceted integrated-circuit dice and packages | Jackson Chung Peng Kong, Jenny Shio Yin Ong, Seok Ling Lim | 2022-03-29 |