Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521932 | Composite bridge die-to-die interconnects for integrated-circuit packages | Bok Eng Cheah, Jackson Chung Peng Kong, Jenny Shio Yin Ong, Seok Ling Lim | 2022-12-06 |
| 11355458 | Interconnect core | Jackson Chung Peng Kong, Bok Eng Cheah, Kooi Chi Ooi | 2022-06-07 |