Issued Patents 2022
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527463 | Hybrid ball grid array package for high speed interconnects | Bok Eng Cheah, Seok Ling Lim, Kooi Chi Ooi, Jackson Chung Peng Kong | 2022-12-13 |
| 11527485 | Electrical shield for stacked heterogeneous device integration | Seok Ling Lim, Bok Eng Cheah, Jackson Chung Peng Kong, Kooi Chi Ooi | 2022-12-13 |
| 11527467 | Multi-chip package with extended frame | Bok Eng Cheah, Seok Ling Lim, Jackson Chung Peng Kong, Kooi Chi Ooi | 2022-12-13 |
| 11521943 | Method of forming a capacitive loop substrate assembly | Tin Poay Chuah, Chin Lee Kuan | 2022-12-06 |
| 11521932 | Composite bridge die-to-die interconnects for integrated-circuit packages | Bok Eng Cheah, Jackson Chung Peng Kong, Ping Ping Ooi, Seok Ling Lim | 2022-12-06 |
| 11508650 | Interposer for hybrid interconnect geometry | Seok Ling Lim, Bok Eng Cheah, Jackson Chung Peng Kong, Kooi Chi Ooi | 2022-11-22 |
| 11508660 | Molded power delivery interconnect module for improved Imax and power integrity | Seok Ling Lim, Bok Eng Cheah, Jackson Chung Peng Kong | 2022-11-22 |
| 11476198 | Multi-level components for integrated-circuit packages | Bok Eng Cheah, Jackson Chung Peng Kong, Seok Ling Lim, Kok Keng Wan | 2022-10-18 |
| 11462488 | Substrate cores for warpage control | Seok Ling Lim, Bok Eng Cheah, Jackson Chung Peng Kong | 2022-10-04 |
| 11430764 | Overhang bridge interconnect | Bok Eng Cheah, Seok Ling Lim, Jackson Chung Peng Kong, Kooi Chi Ooi | 2022-08-30 |
| 11367673 | Semiconductor package with hybrid through-silicon-vias | Seok Ling Lim, Bok Eng Cheah, Jackson Chung Peng Kong | 2022-06-21 |
| 11342289 | Vertical power plane module for semiconductor packages | Bok Eng Cheah, Jackson Chung Peng Kong, Seok Ling Lim, Kooi Chi Ooi | 2022-05-24 |
| 11289427 | Multi-faceted integrated-circuit dice and packages | Bok Eng Cheah, Jackson Chung Peng Kong, Seok Ling Lim | 2022-03-29 |
| 11282780 | Integrated bridge for die-to-die interconnects | Bok Eng Cheah, Seok Ling Lim, Kooi Chi Ooi, Jackson Chung Peng Kong | 2022-03-22 |
| 11284518 | Semiconductor package with co-axial ball-grid-array | Jackson Chung Peng Kong, Bok Eng Cheah, Seok Ling Lim | 2022-03-22 |
| 11227841 | Stiffener build-up layer package | Bok Eng Cheah, Jackson Chung Peng Kong, Seok Ling Lim | 2022-01-18 |