| 11527485 |
Electrical shield for stacked heterogeneous device integration |
Seok Ling Lim, Bok Eng Cheah, Jenny Shio Yin Ong, Jackson Chung Peng Kong |
2022-12-13 |
| 11527467 |
Multi-chip package with extended frame |
Bok Eng Cheah, Seok Ling Lim, Jackson Chung Peng Kong, Jenny Shio Yin Ong |
2022-12-13 |
| 11527463 |
Hybrid ball grid array package for high speed interconnects |
Bok Eng Cheah, Jenny Shio Yin Ong, Seok Ling Lim, Jackson Chung Peng Kong |
2022-12-13 |
| 11508650 |
Interposer for hybrid interconnect geometry |
Jenny Shio Yin Ong, Seok Ling Lim, Bok Eng Cheah, Jackson Chung Peng Kong |
2022-11-22 |
| 11482481 |
Semiconductor device and system |
Bok Eng Cheah, Jackson Chung Peng Kong, Lee Fueng Yap, Chan Kim Lee |
2022-10-25 |
| 11430764 |
Overhang bridge interconnect |
Bok Eng Cheah, Seok Ling Lim, Jenny Shio Yin Ong, Jackson Chung Peng Kong |
2022-08-30 |
| 11355458 |
Interconnect core |
Jackson Chung Peng Kong, Bok Eng Cheah, Ping Ping Ooi |
2022-06-07 |
| 11342289 |
Vertical power plane module for semiconductor packages |
Jenny Shio Yin Ong, Bok Eng Cheah, Jackson Chung Peng Kong, Seok Ling Lim |
2022-05-24 |
| 11282780 |
Integrated bridge for die-to-die interconnects |
Bok Eng Cheah, Jenny Shio Yin Ong, Seok Ling Lim, Jackson Chung Peng Kong |
2022-03-22 |