Issued Patents 2022
Showing 1–25 of 26 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11540395 | Stacked-component placement in multiple-damascene printed wiring boards for semiconductor package substrates | Bok Eng Cheah, Chin Lee Kuan | 2022-12-27 |
| 11527485 | Electrical shield for stacked heterogeneous device integration | Seok Ling Lim, Bok Eng Cheah, Jenny Shio Yin Ong, Kooi Chi Ooi | 2022-12-13 |
| 11527481 | Stacked semiconductor package with flyover bridge | Choong Kooi Chee, Bok Eng Cheah, Teong Guan Yew, Loke Yip Foo | 2022-12-13 |
| 11527463 | Hybrid ball grid array package for high speed interconnects | Bok Eng Cheah, Jenny Shio Yin Ong, Seok Ling Lim, Kooi Chi Ooi | 2022-12-13 |
| 11527479 | Stepped interposer for stacked chip package | Chin Lee Kuan, Bok Eng Cheah | 2022-12-13 |
| 11527467 | Multi-chip package with extended frame | Bok Eng Cheah, Seok Ling Lim, Jenny Shio Yin Ong, Kooi Chi Ooi | 2022-12-13 |
| 11521932 | Composite bridge die-to-die interconnects for integrated-circuit packages | Bok Eng Cheah, Jenny Shio Yin Ong, Ping Ping Ooi, Seok Ling Lim | 2022-12-06 |
| 11508660 | Molded power delivery interconnect module for improved Imax and power integrity | Seok Ling Lim, Bok Eng Cheah, Jenny Shio Yin Ong | 2022-11-22 |
| 11508650 | Interposer for hybrid interconnect geometry | Jenny Shio Yin Ong, Seok Ling Lim, Bok Eng Cheah, Kooi Chi Ooi | 2022-11-22 |
| 11482481 | Semiconductor device and system | Bok Eng Cheah, Kooi Chi Ooi, Lee Fueng Yap, Chan Kim Lee | 2022-10-25 |
| 11476198 | Multi-level components for integrated-circuit packages | Bok Eng Cheah, Jenny Shio Yin Ong, Seok Ling Lim, Kok Keng Wan | 2022-10-18 |
| 11462468 | Semiconductor package, semiconductor system, and method of forming semiconductor package | Bok Eng Cheah | 2022-10-04 |
| 11462488 | Substrate cores for warpage control | Seok Ling Lim, Bok Eng Cheah, Jenny Shio Yin Ong | 2022-10-04 |
| 11430764 | Overhang bridge interconnect | Bok Eng Cheah, Seok Ling Lim, Jenny Shio Yin Ong, Kooi Chi Ooi | 2022-08-30 |
| 11398415 | Stacked through-silicon vias for multi-device packages | Bok Eng Cheah, Choong Kooi Chee, Tat Hin Tan, Wai Ling Lee | 2022-07-26 |
| 11393758 | Power delivery for embedded interconnect bridge devices and methods | Bok Eng Cheah, Loke Yip Foo, Wai Ling Lee | 2022-07-19 |
| 11393741 | Micro through-silicon via for transistor density scaling | Bok Eng Cheah, Choong Kooi Chee, Wai Ling Lee, Tat Hin Tan | 2022-07-19 |
| 11375617 | Three dimensional foldable substrate with vertical side interface | Tin Poay Chuah, Bok Eng Cheah | 2022-06-28 |
| 11367673 | Semiconductor package with hybrid through-silicon-vias | Seok Ling Lim, Bok Eng Cheah, Jenny Shio Yin Ong | 2022-06-21 |
| 11363717 | Inductor array and support | Bok Eng Cheah, Ranjul Balakrishnan | 2022-06-14 |
| 11355458 | Interconnect core | Bok Eng Cheah, Ping Ping Ooi, Kooi Chi Ooi | 2022-06-07 |
| 11342289 | Vertical power plane module for semiconductor packages | Jenny Shio Yin Ong, Bok Eng Cheah, Seok Ling Lim, Kooi Chi Ooi | 2022-05-24 |
| 11289427 | Multi-faceted integrated-circuit dice and packages | Bok Eng Cheah, Jenny Shio Yin Ong, Seok Ling Lim | 2022-03-29 |
| 11284518 | Semiconductor package with co-axial ball-grid-array | Bok Eng Cheah, Jenny Shio Yin Ong, Seok Ling Lim | 2022-03-22 |
| 11282780 | Integrated bridge for die-to-die interconnects | Bok Eng Cheah, Jenny Shio Yin Ong, Seok Ling Lim, Kooi Chi Ooi | 2022-03-22 |