Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11398415 | Stacked through-silicon vias for multi-device packages | Bok Eng Cheah, Choong Kooi Chee, Jackson Chung Peng Kong, Wai Ling Lee | 2022-07-26 |
| 11393741 | Micro through-silicon via for transistor density scaling | Bok Eng Cheah, Choong Kooi Chee, Jackson Chung Peng Kong, Wai Ling Lee | 2022-07-19 |
| 11373694 | Generic physical layer providing a unified architecture for interfacing with an external memory device and methods of interfacing with an external memory device | Soon Chieh Lim, Chee Hak Teh | 2022-06-28 |