Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11398415 | Stacked through-silicon vias for multi-device packages | Bok Eng Cheah, Choong Kooi Chee, Jackson Chung Peng Kong, Tat Hin Tan | 2022-07-26 |
| 11393741 | Micro through-silicon via for transistor density scaling | Bok Eng Cheah, Choong Kooi Chee, Jackson Chung Peng Kong, Tat Hin Tan | 2022-07-19 |
| 11393758 | Power delivery for embedded interconnect bridge devices and methods | Bok Eng Cheah, Jackson Chung Peng Kong, Loke Yip Foo | 2022-07-19 |