Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527481 | Stacked semiconductor package with flyover bridge | Choong Kooi Chee, Bok Eng Cheah, Teong Guan Yew, Jackson Chung Peng Kong | 2022-12-13 |
| 11393758 | Power delivery for embedded interconnect bridge devices and methods | Bok Eng Cheah, Jackson Chung Peng Kong, Wai Ling Lee | 2022-07-19 |